Comparative Studies and Failure Mechanism of Ceramic Adhesive and Organic Adhesive for Fabrication of Polymer to Metal

S. Bhowmik,R. Benedictus

Abstract:In this investigation, attempts have been made at fundamental understanding the rationale to using ceramic adhesive for structural fabrication of polymer to metal and a comparative study has been made with organic adhesive. Therefore, polymer (Polybenzimidazole) to titanium sheets are fabricated by a ceramic adhesive (Resbond 907 GF, the service temperature of this adhesive ranges from –185 C to +1290 C) and ultra high temperature resistant epoxy adhesive (DURALCO 4703, the service temperature of the adhesive is –260 C to +350 C). Prior to fabrication, the surfaces of the titanium are mechanically polished by wire brushing, cleaned by isopropanol and then modified by plasma nitriding implantation and the surface of the polybenzimidazole is ultrasonically cleaned by acetone followed by its modification through low-pressure plasma by using 13.56 MHz RF Glow Discharge for 120 seconds at 100 W of power using nitrogen as process gas. Surface characteristics of Titanium and the polymer are analysed by estimating surface energy and ESCA studies. Tensile lap shear tests are performed according to the ASTM D 5868-95 standard. It is observed that although the thermal properties of ceramic adhesive are far superior to the organic adhesive, however, in terms of mechanical properties it is relatively inferior. However, when ceramic nano powders are dispersed in to the epoxy adhesive, there is a significant increase in adhesive bond strength. In this context, failure mechanism has been investigated under Scanning Electron Microscope (SEM). It is interesting to observe that when the surface modified polymer and titanium are fabricated by the epoxy adhesive, failure is completely within the adhesive, however, when the surface modified polymer and titanium are fabricated by ceramic adhesive, failure is significantly interfacial from the polymer to the ceramic adhesive. Therefore, it is possible that interfacial interaction between the ceramic adhesive to the polymer is not compatible as such, however, that is not the case when ceramic nano powders are subject to interfacial interaction with the matrix epoxy adhesive resulting in increasing adhesive bond strength. It is further observed that when the nano ceramic epoxy adhesive are exposed to mixed field radiation to promoting crosslink density, it increases the joint strength significantly, however, in the case of ceramic adhesive, there is no such improvement. Consequently, application of ceramic adhesive for fabrication of polymer to metal in respect of organic adhesive is still limited despite having the facts that ceramic adhesive shows superior thermal properties to organic adhesive. *Correspondence author and Presenter Tel: +31-15-27-84186 Fax: +31-15-27-81151 Email: S.Bhowmik@TUDelft.Nl

Engineering,Materials Science