Abstract:Silicon carbide (SiC) particle-reinforced aluminum matrix (SiC p /Al) composites are increasingly finding applications across a range of industries due to their exceptional mechanical properties. However, these composites often face challenges in achieving optimal machinability and meeting quality standards, primarily due to the presence of SiC particles, which can hinder their full potential. This study focuses on addressing these challenges through the application of ultrasonic vibration-assisted helical grinding (UVHG) to enhance the efficiency and quality of SiC p /Al composites. To achieve the desired quality and efficiency improvements, a comprehensive methodology involving ultrasonic vibration-assisted helical grinding (UVHG) has been implemented for SiC p /Al composites. A mechanical cutting force model was then developed to accurately predict grinding forces. The grinding force was deconstructed into distinct components: friction force, plastic deformation force, and fracture force, taking into account the underlying material removal mechanisms. To better understand the grinding force associated with a single diamond abrasive grit, parameters such as undeformed chip thickness and cross-sectional area were calculated and subsequently extrapolated to the entire tool. Introducing an innovative approach, the model incorporates the concept of an acoustic softening coefficient, which quantifies the reduction in deformation stress resulting from ultrasonic vibration. This coefficient serves to correct and account for the influence of ultrasonic vibration on the properties of SiC p /Al composites. Experimental machining using the UVHG technique was conducted across various test groups. The experimental outcomes aligned closely with the predicted cutting force values, with a deviation of only 5.07%. This alignment underscores the accuracy of the proposed model and its potential as a guiding framework for optimizing the grinding process of SiC p /Al composites. The newly established predictive cutting force model, coupled with the innovative UVHG machining approach, offers promising avenues for effectively machining SiC p /Al composites on an industrial scale. This advancement not only enhances the application potential of SiC p /Al composites but also paves the way for future research and development in this field.

Revealing cutting mode transition in diamond cutting of SiCp/Al based on specific cutting energy model

Simulation and experimental investigation on the cutting mechanism and surface generation in machining SiCp/Al MMCs

Finite element and experimental analysis of surface integrity and surface roughness of precision machining SiCp/Al

Cutting path-dependent machinability of SiCp/Al composite under multi-step ultra-precision diamond cutting

Coupled effect of tool geometry and tool-particle position on diamond cutting of SiCp/Al

Multi-step Cutting Depth Optimization Method Based on the Removal Mechanism of SiCp/Al

Atomistic investigation of machinability of monocrystalline 3C–SiC in elliptical vibration-assisted diamond cutting

Investigation on the cutting mechanism of SiCp/Al composites in ultrasonic elliptical vibration machining

Multidimensional ultrasonic vibration machining modeling of SiCp/Al cutting forces with different volume fractions: Experiments and numerical simulations

A Numerical Analysis of Ductile Deformation during Nanocutting of Silicon Carbide via Molecular Dynamics Simulation

Modeling and investigation of cutting force for SiCp/Al composites during ultrasonic vibration-assisted turning

Experimental Studies of the Machinability of SiCp/Al with Different Volume Fractions under Ultrasonic-Assisted Grinding

Investigation on the influence of SiC particle parameters on the machinability of SiCp/Al composite

Study on the High-Speed Milling Performance of High-Volume Fraction SiCp/Al Composites

Study on the formation mechanism of surface defects in the processing of large particle SiCp/Al composites

Investigation on the machinability of SiCp/Al composite by in-situ laser assisted diamond cutting

Material removal mechanism of brittle-ductile transition in milling SiC ceramic and experimental verification

Modeling for ultrasonic vibration-assisted helical grinding of SiC particle-reinforced Al-MMCs

Atomistic origin of brittle-to-ductile transition behavior of polycrystalline 3C–SiC in diamond cutting

On understanding the cutting mechanism of SiCp/Al composites during ultrasonic elliptical vibration-assisted machining

Study on cutting temperatures of SiCp ∕ Al composites for ultrasonic vibration-assisted cutting