Degradation of stable thermosetting epoxy resins mediated by bases in amide solvents

Yasunori Minami,Tomoo Tsuyuki,Hayato Ishikawa,Yoshihiro Shimoyama,Kazuhiko Sato,Masaru Yoshida
DOI: https://doi.org/10.1038/s41428-024-00979-6
IF: 3.135
2024-11-23
Polymer Journal
Abstract:Thermosetting epoxy resins are widely used in our society for adhesives, electronic devices, and building materials owing to their hardness and chemical stability; however, their robustness hinders their ability to chemically degrade to monomers and related low-molecular-weight molecules. Herein, we report the degradation of various thermosetting epoxy resins prepared from bisphenol A diglycidyl ether as a typical epoxy agent and various curing agents, such as diamino arenes, dithiols, and acid anhydrides. The degradation proceeded smoothly when sodium tert -butoxide was used as an activator in a 1,3-dimethyl-2-imidazolidinone solvent at 150 °C to form bisphenol A as a monomer precursor in high yields without any pretreatment. The proposed degradation method was successfully applied to cross-linked thermosetting epoxy resins derived from 4,4'-diaminodiphenylsulfone, a heat-resistant curing agent, commercially available adhesives, and carbon fiber-reinforced composite materials. When composite materials are used, the carbon fibers can be recovered intact.
polymer science
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