TGO and Al diffusion behavior of CuAlxNiCrFe high-entropy alloys fabricated by high-speed laser cladding for TBC bond coats

Qing-Long Xu,Kang-Cheng Liu,Ke-Yan Wang,Li-Yan Lou,Yu Zhang,Chang-Jiu Li,Cheng-Xin Li
DOI: https://doi.org/10.1016/j.corsci.2021.109781
IF: 7.72
2021-11-01
Corrosion Science
Abstract:CuAlxNiCrFe (x = 0.5, 1, 1.5, 2) high-entropy alloys (HEAs) with good high-temperature oxidation resistance were deposited as bond coats via high-speed laser cladding. The microstructure of the CuAlxNiCrFe bond coats exhibited the columnar-to-equiaxed grain transition with increasing Al content. All bond coats generated a uniform and dense aluminum oxide layer and exhibited a low thermally grown oxide (TGO) growth rate after 100 h of oxidation at 1100 °C. During oxidation, CuAl1.5NiCrFe exhibited an extremely low Al diffusion coefficient, and the grain size of CuAlNiCrFe only grew by ~20%.
materials science, multidisciplinary,metallurgy & metallurgical engineering
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