Study on the low-temperature toughness of rubber-modified epoxy resin

Luo Shao-jie
Abstract:An epoxy resin based on diglycidyl ether of bisphenol A has been modified with carboxyl-terminated butadiene-acrylonitrile rubber (CTBN) and cured with low molecule polyamide (PA300). The effects of rubber flexibilizer, curing agent, inorganic filler and diluents on toughening property were studied. Dynamic mechanical analysis (DMA) and the stress-strain behavior revealed that the system is excellent low temperature toughness.
Engineering,Materials Science
What problem does this paper attempt to address?