Armands Ostrovskis,Toms Salgals,Benjamin Krueger,Fabio Pittala,Mahdieh Joharifar,Richard Schatz,Michael Koenigsmann,Yuchuan Fan,Marek Chacinski,Urban Westergren,Lu Zhang,Haik Mardoyan,Sandis Spolitis,Sergei Popov,Xianbin Yu,Markus Gruen,Vjaceslavs Bobrovs,Hadrien Louchet,Xiaodan Pang,Oskars Ozolins

Abstract:Development of Data Center based computing technology require energy efficient high-speed transmission links. This leads to optical amplification-free intensity modulation and direct detection (IM/DD) systems with low complexity equalization compliant with IEEE standardized electrical interfaces. Switching from on-off keying to multi-level pulse amplitude modulation would allow to reduce lane count for next generation Ethernet interfaces. We characterize 106.25 Gbaud on-off keying, 4-level and 6-level pulse amplitude modulation links using two integrated transmitters: O-band directly modulated laser and C-band externally modulated laser. Simple feed forward or decision feedback equalizer is used. We demonstrate 106.25 Gbaud on-off keying links operating without forward error correction for both transmitters. We also show 106.25 Gbaud 4-level and 6-level pulse amplitude modulation links with performance below 6.25% overhead hard-decision forward error threshold of 4.5 x 10(-3). Furthermore, for EML-based transmitter we achieve 106.25 Gbaud 4-level pulse amplitude modulation performance below KP-FEC threshold of 2.2 x 10(-4). That shows that we can use optics to support (2x)100 Gbps Ethernet on single lambda at expense of simple forward error correction.

The Design of LVDS Bus with High EMC Compliance

A Compact Passive Equalizer Design for Differential Channels in TSV-Based 3-D ICs

Design of LVDS bus for transmitting high-speedly long distance

106.25 Gbaud On-Off Keying and Pulse Amplitude Modulation Links Supporting Next Generation Ethernet on Single Lambda

Methods and designs for improving the signal integrity for 3D electrical interconnects in high performance IC packaging

Low stray inductance bus bar design and construction for good EMC performance in power electronic circuits

Signal Integrity Optimization of MLVDS Based Multi-Master Instrument Bus

Signal Integrity Simulation and Analysis in High-Speed Interconnects by Using FDTD

Design of SubLVDS driver circuit

784Mb/s transmitter design with a 0.181μm CMOS technology

784Mb/s Transmitter Design With a 0.18μm CMOS Technology

M-LVDS receivers keep it safe with multi- level fault detection

SIGNAL PROPAGATION IN HIGH SPEED DIFFERENTIAL TRANSMISSION LINE USING PARALLELIZED FINITE-DIFFERENCE TIME-DOMAIN METHOD

Analysis of Signal Propagation in High-Speed Differential Signal Lines with Full-Wave Time-Domain Technique

Investigations on Delay Interconnect Lines for High-Speed Designs with the Numerical Technique

Signal Propagation Effects on High‐speed Interconnection Lines Using Time‐domain Numerical Technique

A bit error rate measurement system for LVDS signal transmission based on USB interface

Design of a Power Efficient Self-Adaptive LVDS Driver.

Design of High-Performance Multiphase C Lock Generator Used in LVDS Driver with 0.25μm CMOS Technology

Different designs of TSVs for 3D IC: Signal integrity analysis with cascaded scattering matrix

Development of Low Cost Optical Interconnection Data Link