Abstract:The increasing demand for designing and manufacturing micro parts with high quality comes from the high speed development of micro electromechanical systems (MEMS) and nano electromechanical systems (NEMS) in recent years. Nanometric cutting as an important machining way of micro parts has become a hot spot in machining field. Some main issues in nanometric cutting such as chip formation, machined surface quantity and diamond tool wear etc., have been investigated by molecular dynamics. Previous researchers have pointed out that, the generation and evolution of defects are mainly, responsible for causing plastic deformation of machined workpiece in nanometric cutting of plastic materials and a high compressive stress remaining in shear zone is considered beneficial to ductile-mode machining of brittle materials. Up to now, however, the influence of cutting thickness on defect behaviors and stress distribution in a workpiece and the relationship between them for single crystal materials are still unclear. In the present study, molecular dynamics simulations of nanometric cutting of single crystal Cu were performed. The simulation results show that stacking fault and partial dislocation are two main types of the defects in workpieces. A high surface stress at the atomic scale was observed in workpieces and there exist the compressive stress in shear zones and tensile stresses in the machined surfaces. It is found that the stress-distance curves of workpieces present a clear periodicity corresponding to the generation and evolution of dislocations in them. At the beginning of cutting (a small cutting thickness), no apparent stacking faults inside workpieces have been found, but with the increase of cutting thickness, the defects on surfaces and subsurfaces increase significantly and the thicker the cutting thickness, the smaller the corresponding stress components.

A nanotwin-based analytical model to predict dynamics in cryogenic orthogonal machining copper

Modeling Grain Size Dependent Optimal Twin Spacing for Achieving Ultimate High Strength and Related High Ductility in Nanotwinned Metals

Simulating Size and Volume Fraction-Dependent Strength and Ductility of Nanotwinned Composite Copper

Modeling the Strain Rate-Dependent Constitutive Behavior in Nanotwinned Polycrystalline Metals

Atomistic and Theoretical Insights on Nanoprecipitates-Controlled Strengthening Behavior for Optimum Mechanical Performance in Nanotwinned NiCoCr Alloys

Coupled Thermo-mechanical Model for Metal Orthogonal Cutting Process and Finite Element Simulation

Molecular dynamics simulations of nanomachining mechanism and thermal effects of single crystal Cu

Multi-mechanism-based Twinning Evolution in Machined Surface Induced by Thermal-Mechanical Loads with Increasing Cutting Speeds

MOLECULAR DYNAMICS SIMULATIONS OF NANOMA-CHINING MECHANISM AND THERMAL EFFECTS OF SINGLE CRYSTAL Cu

Large Scale Molecular Dynamics Study of Nanometric Machining of Copper

Molecular Dynamics Simulations of Thermal Effects in Nanometric Cutting Process

Molecular dynamics simulation of the influence of nanocutting parameters on microstructure of AISI M2

Molecular Dynamics Simulation of Nanometric Cutting of Polycrystalline Copper

Atomistic simulation of thermal effects and defect structures during nanomachining of copper

Multiscale Simulation of Nanometric Cutting of Single Crystal Copper—effect of Different Cutting Speeds

Simulation Analysis of Ti6Al4V Cutting Under Liquid Nitrogen Cryogenic Cooling

MOLECULAR DYNAMICS SIMULATION OF NANOMETRIC CUTTING CHARACTERISTICS OF SINGLE CRYSTAL Cu

Experiment and numerical study of chip formation mechanism during cryogenic machining of Ti-6Al-4V alloy

Researching Nanometric Cutting of Copper Based on Molecular Dynamics

Nanoscale cutting simulation of single crystal copper based on multiscale method

Multiscale Simulation of Nanometric Cutting of Single Crystal Copper and Its Experimental Validation