Abstract:VLSI is large in scale, and complex in structure. In todays nano-VLSI, serious process variations induced by the complex nanometer integrated circuit process technology may result in severe degradation of the integrated circuit performance. These factors present ever increasing challenges for present day nano-scale VLSI design. Interconnect modeling and lithography simulations rely on numerical approaches for solving large-scale Maxwells equations, of which the computational cost is extremely high. In this paper, several massively parallel computing approaches for interconnect modeling and lithography simulation are surveyed, based on adaptive finite element theory and a parallel hierarchical grid (PHG) platform. Regarding interconnect modeling, we first review the parallel adaptive finite-element method ParAFEMCap for parasitic capacitance extraction, which achieves a parallel efficiency of 75.7\% on 1536 CPU cores. In addition, we review a hybridization of the boundary integral equation method and the random walk on spheres method (BIE-WOS) for surface charge density computations for conductors or dielectric mediums. The proposed method proves to be superior to existing methods for massively parallel computing. On a supercomputer with 5120 CPU cores, BIE-WOS can achieve almost a linear parallel efficiency. Regarding lithography simulation, we propose a parallel adaptive finite-element framework method by adopting the PHG (parallel hierarchical grid) platform and a perfectly matched anisotropy uniaxial layer to handle scattering boundary conditions.

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