Abstract:Driven by the evolution of electronic packaging technology for high-dense integration of high-power, high-frequency, and multi-function devices in modern electronics, thermal management materials have become a crucial component for guaranteeing the stable and reliable operation of devices. Because of its admirable in-plane thermal conductivity, graphene is considered as a desired thermal conductor. However, the promise of graphene films has been greatly weakened as the existence of grain boundaries lead to a high extent of phonon scattering. Here, a stitching strategy is adopted to fabricate an rGO/g-C3N4 film, where 2D g-C3N4 works as a linker to covalently connect adjacent rGO sheets for expanding the size of graphene and forming an in-plane rGO/g-C3N4 heterostructure. The in-plane thermal conductivity of the rGO/g-C3N4 film reaches 41.2 W m–1 K–1 at a g-C3N4 content of only 1 wt %, which increased by 17.3% compared to pristine rGO. The interfaced thermal resistance between rGO and g-C3N4 is further examined by non-equilibrium molecular dynamics simulations. Furthermore, owing to the unique light absorption and welding ability of g-C3N4, the rGO/g-C3N4 film presents superior solar-thermal and electric-thermal responses to controllably regulate the chip temperature against overcooling. This work provides a facile approach to construct a large-sized rGO sheet and combines heat dissipation and heating capability in the same thermal management material for future electronics.The Supporting Information is available free of charge at <a class="ext-link" href="/doi/10.1021/acsami.0c22057?goto=supporting-info">https://pubs.acs.org/doi/10.1021/acsami.0c22057</a>.Thermally conductive calculation, molecular dynamics simulations, FTIR spectra, SEM, EDS mapping, XPS, and electrical conductivity of the samples (<a class="ext-link" href="/doi/suppl/10.1021/acsami.0c22057/suppl_file/am0c22057_si_001.pdf">PDF</a>)This article has not yet been cited by other publications.

Highly Thermally Conductive and Structurally Ultra-Stable Graphitic Films with Seamless Heterointerfaces for Extreme Thermal Management

Bidirectionally High‐Thermally Conductive and Environmentally Adaptive Graphene Thick Films Enabled by Seamless Bonding Assembly for Extreme Thermal Management

Carbon Nanotube Films with Ultrahigh Thermal-Shock and Thermal-Shock-fatigue Resistance Characterized by Ultra-Fast Ascending Shock Testing

Enhanced Thermoelectric Performance In Graphitic Zno (0001) Nanofilms

Nanomanufacturing of Graphene Nanosheets Through Nano-Hole Opening and Closing

Ultrastiff, Strong, and Highly Thermally Conductive Crystalline Graphitic Films with Mixed Stacking Order.

Multifunctional Liquid Metal‐Bridged Graphite Nanoplatelets/Aramid Nanofiber Film for Thermal Management

Highly Thermally Conductive and Flexible Thermal Interface Materials with Aligned Graphene Lamella Frameworks

Co-enhancement of Thermal Conduction and Radiation Through Morphologies Controlling of Graphene Functional Layer for Chip Thermal Management

Flexible Fluorinated Graphene/Poly(vinyl Alcohol) Films toward High Thermal Management Capability

Lateral Heterostructure Formed by Highly Thermally Conductive Fluorinated Graphene for Efficient Device Thermal Management

Stitching Graphene Sheets with Graphitic Carbon Nitride: Constructing a Highly Thermally Conductive rGO/g-C 3 N 4 Film with Excellent Heating Capability

Fabrication of Cu/graphite film/Cu sandwich composites with ultrahigh thermal conductivity for thermal management applications

Mechanically Robust Fluorinated Graphene/Poly( p -Phenylene Benzobisoxazole) Nanofiber Films with Low Dielectric Constant and Enhanced Thermal Conductivity: Implications for Thermal Management Applications

Pressure-Induced Self-Interlocked Structures for Expanded Graphite Composite Papers Achieving Prominent EMI Shielding Effectiveness and Outstanding Thermal Conductivities

Controllable Construction of CNT-Interconnected Liquid Metal Networks for Thermal Management

Self-Exfoliation of Flake Graphite for Bioinspired Compositing with Aramid Nanofiber toward Integration of Mechanical and Thermoconductive Properties

Defects boost graphitization for highly conductive graphene films

2D-Topology-seeded Graphitization for Highly Thermally Conductive Carbon Fibers

Enhanced thermal conductivity and lower density composites with brick-wall microstructure based on highly oriented graphite nanoplatelet: towards manufacturable cooling substrates for high power density electronic devices

A modified spin-casting approach for scalable preparation of ultra-thick reduced graphene oxide films with high thermal conductivity