Toward ultrahigh thermal conductivity graphene films
Sihua Guo,Amos Nkansah,Abdelhafid Zehri,Murali Murugesan,Yong Zhang,Yan Zhang,Chen Yu,Yifeng Fu,Markus Enmark,Jin Chen,Xinfeng Wu,Wei Yu,Johan Liu,Shujing Chen
DOI: https://doi.org/10.1088/2053-1583/ac9421
IF: 6.861
2022-09-24
2D Materials
Abstract:With the increasing demands of high-performance electronics, electronic devices generate more heat. Thus, efficient heat dissipation is crucially needed. Owing to its extremely good thermal conductivity, graphene is an interesting candidate for this purpose. In this paper, a two-step temperature-annealing process to fabricate ultrahigh thermal conductive graphene films (GFs) is proposed. The thermal conductivity of the obtained GFs was as high as 3826 ± 47 W m−1 K−1. Extending the time of high-temperature annealing significantly improved the thermal performance of the GF. Structural analyses confirmed that the high thermal conductivity is caused by the large grain size, defect-free stacking, and high flatness, which are beneficial for phonon transmission in the carbon lattice. The turbostratic stacking degree decreased with increasing heat treatment time. However, the increase in the grain size after long heat treatment had a more pronounced effect on the phonon transfer of the GF than that of turbostratic stacking. The developed GFs show great potential for efficient thermal management in electronics devices. Keywords: Graphene film, Ultrahigh thermal conductivity, Heat treatment time
materials science, multidisciplinary