Evaluation of the Thermal Performance for a Wire Mesh/Hollow Glass Microsphere Composite Structure as a Conduction Barrier

S. Mckenna

2010-01-15

Abstract:Evaluation of the Thermal Performance for a Wire Mesh/Hollow Glass Microsphere Composite Structure as a Conduction Barrier. (December 2008) Sean Li McKenna, B.S., University of Florida Chair of Advisory Committee: Dr. Egidio Marotta An experimental investigation exploring the use of wire mesh/hollow glass microsphere combination for use as thermal insulation was conducted with the aim to conclude whether or not it represents a superior insulation technology to those on the market. Three primary variables, including number of wire mesh layers, filler material, and temperature dependence were studied using an apparatus that was part of L.I.C.H.E.N (LabVIEW Integrated Conduction Heat Experiment Network), a setup whose basic components allow three vertically stacked samples to be thermally and mechanically controlled. Knowing the temperature profile in the upper and lower samples allows for determination of thermal conductivity of the middle material through the use of Fourier’s law. The numbers of layers investigated were two, four, six, and eight, with each separated by a metallic liner. The filler materials included air, s15, s35 and s60HS 3M TM hollow glass microspheres. The experiments were conducted at four temperatures of 300, 330, 366, and 400K with an interface pressure of 20 Psi.

Engineering,Materials Science