Micromechanical mechanism of creep secondary crack propagation behavior for superalloy

Xu Zhao,He Zhao,Yingdong Song,Zhigang Sun,Xuming Niu,Sisi Yuan
DOI: https://doi.org/10.1016/j.jallcom.2024.173677
IF: 6.2
2024-02-08
Journal of Alloys and Compounds
Abstract:To disclose the micromechanical mechanism of secondary crack propagation behavior for superalloy during creep, the related behavior for superalloy GH4169 was studied systematically based on the grain boundary (GB) structure, trace inclination, neighbouring grains orientation and the stresses acting on the boundary. The secondary crack propagation mechanism was elucidated comprehensively from microstructural and mechanical viewpoints. The results indicated that the grain boundaries (GBs) for secondary crack propagation are all random boundaries. Due to the low GB energy, coincidence site lattice (CSL) boundaries and low-angle grain boundaries (LAGBs) exhibited high cracking resistance. The random boundaries with the misorientation of 45°∼50° showed high cracking susceptibility. The boundaries where the neighbouring grains with Schmid factor greater than 0.42, Schmid factor mismatch less than 0.10, and geometric compatibility factor less than 0.3 exhibited low cracking resistance. In addition, in terms of mechanical criteria, the main mechanical factor controlling secondary crack propagation was the normalized GB shear stress, i.e., most cracked GBs were at ∼45° to the loading direction (LD) which suffered maximum shear stress, and the normalized normal stress (corresponding GBs with maximum normal stress perpendicular to the LD) also played a role to some extent.
materials science, multidisciplinary,chemistry, physical,metallurgy & metallurgical engineering
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