Wafer‐Level Manufacturing of MEMS H 2 Sensing Chips Based on Pd Nanoparticles Modified SnO 2 Film Patterns

Zheng Zhang,Liyang Luo,Yanlin Zhang,Guoliang Lv,Yuanyuan Luo,Guotao Duan
DOI: https://doi.org/10.1002/advs.202302614
IF: 15.1
2023-07-03
Advanced Science
Abstract:In this manuscript, a simple method combining atomic layer deposition and magnetron sputtering is developed to fabricate high-performance Pd/SnO<sub>2</sub> film patterns applied for micro-electro-mechanical systems (MEMS) H<sub>2</sub> sensing chips. SnO<sub>2</sub> film is first accurately deposited in the central areas of MEMS micro hotplate arrays by a mask-assistant method, leading the patterns with wafer-level high consistency in thickness. The grain size and density of Pd nanoparticles modified on the surface of the SnO<sub>2</sub> film are further regulated to obtain an optimized sensing performance. The resulting MEMS H<sub>2</sub> sensing chips show a wide detection range from 0.5 to 500 ppm, high resolution, and good repeatability. Based on the experiments and density functional theory calculations, a sensing enhancement mechanism is also proposed: a certain amount of Pd nanoparticles modified on the SnO<sub>2</sub> surface could bring stronger H<sub>2</sub> adsorption followed by dissociation, diffusion, and reaction with surface adsorbed oxygen species. Obviously, the method provided here is quite simple and effective for the manufacturing of MEMS H<sub>2</sub> sensing chips with high consistency and optimized performance, which may also find broad applications in other MEMS chip technologies.
materials science, multidisciplinary,nanoscience & nanotechnology,chemistry
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