Highly Tough and Reliable Poly(amic acid) with Ballistic Impact‐Resistance Through Modulation of Hydrogen Bonding Interactions

Qiang Zhang,Ling Yue,Rui Yan,Der‐Jang Liaw,Jianzhong Shi,Zhen Li,Chenyu Liang,Yilong Cheng,Zhishen Ge,Yanfeng Zhang

DOI: https://doi.org/10.1002/marc.202300092

IF: 5.006

2023-04-10

Macromolecular Rapid Communications

Abstract:Poly(amic acid) (PAA) materials as the precursor of polyimide generally show remarkably poor mechanical properties, thus limiting their application as the engineering plastics. In this study, we demonstrate that the mechanical properties of PAA materials can be improved significantly for tens of folds with breaking strength > 50 MPa, Young's modulus > 400 MPa, and elongation at break > 300% by incorporation of 20% (mol%) poly(propylene glycol) (PPO) soft segments. The optimization for suitable hard‐soft composition with 20% PPO and the existence of various hydrogen bonds with different binding energies can dissipate energies efficiently, which simultaneously improve the material strength and toughness. In addition, PAA82 films exhibit excellent tolerance towards cyclic stretch, and have the capability to resist various harsh conditions including solar radiation testing (1 sun), heat (85 °C), alkalinity (pH 10), and acidity (pH 4) over one month. Noted that, PAA82 films can be laminated with Kapton films, which show excellent resistance to ultrahigh (200 °C) and ultralow temperature (‐196 °C). The laminated film also exhibits bulletproof property with a thickness of 6 mm. The strategy via modulation of hard‐soft compositions and hydrogen bonds in PAA materials shows great potentials to improve the mechanical properties of polymeric materials. This article is protected by copyright. All rights reserved

polymer science