In‐Depth Investigation of Inkjet‐Printed Silver Electrodes over Large‐Area: Ink Recipe, Flow, and Solidification

Lu Zhou,Xiaolian Chen,Wenming Su,Zheng Cui,Wen‐Yong Lai

DOI: https://doi.org/10.1002/admi.202102548

IF: 5.4

2022-03-15

Advanced Materials Interfaces

Abstract:Advanced Materials Interfaces, EarlyView.

materials science, multidisciplinary,chemistry

What problem does this paper attempt to address?

Preparation, Characterization and Reaction Mechanism of A Novel Silver-Organic Conductive Ink

Yu Chang,Dong-Yu Wang,Yan-Long Tai,Zhen-Guo Yang

DOI: https://doi.org/10.1039/c2jm34569b

2012-01-01

Journal of Materials Chemistry

Abstract:A novel silver-organic conductive ink with no particles, consisting of silver–amide complex dispersed in glycol–water mixture, was developed in a simple way. The reaction mechanism during sintering was also studied and a multi-mechanism was found for the first time. Silver ions in solution can be reduced by glycol to metallic silver following the typical polyol process. Meanwhile, silver–amide complex will decompose to silver oxide, and is then immediately reduced by glycol. The result indicates that the silver oxide reduction mechanism plays a major role in the whole reaction. The type of amine has a great influence on the properties of the ink. When adding a proper amount of γ-(2,3-epoxypropoxy)propyltrimethoxysilane (KH-560), both the conductivity and adhesion of sintered silver film will be improved. Microstructures of the silver film were observed, and a multi-layered structure was detected. The relationships between structure and resistivity and adhesion were also researched. After being filled into a marker and drawn on polyimide (PI) film, the conductive ink was sintered at 150 °C for 1 hour using an oven, and the resistivity of the silver film was 18 μΩ cm, about 11 times that of bulk silver.
Green Approach to Prepare Silver Nanoink with Potentially High Conductivity for Printed Electronics

Yan-Long Tai,Ying-Xia Wang,Zhen-Guo Yang,Zhi-Qiang Chai

DOI: https://doi.org/10.1002/sia.3737

2011-01-01

Surface and Interface Analysis

Abstract:A new strategy was described for green preparation of silver nanoink with potentially high conductivity for printed electronics. Silver nanoparticles in the ink were characterized by visible ultraviolet spectrophotometer (UV‐vis), Transmission Electron Microscope (TEM), size distribution analysis (SDA), X‐Ray Diffractomer (XRD) and differential scanning calorimetry (DSC). Silver thin film was investigated by SEM and 4‐point probe. It can be found that silver nanoparticles are of small sizes about 2.1 ± 0.5 nm in diameter, with a low melting point of about 105°. It also can be concluded that continuous silver thin film has formed, and an integrated conductive track has been fabricated. Especially, when the solid content is up to 9 wt.% and the sintering condition is 200° for 30 minutes in air, the resistivity can decrease to 8.1 µΩ·cm, 4.9 times the bulk silver resistivity. In addition, the application of silver nanoink in conductive patterns on polyimide (PI) substrate was also studied by inkjet printing. Copyright © 2011 John Wiley & Sons, Ltd.
Preparation of Nano-Silver Conductive Ink and Electrode Properties

Shi Keying,Song Yanlin,Wang Shuo,Zhang Xingye,Kang Jiameng

Abstract:In this work, silver nanoparticles with the size in the range of 30 nm to50 nm were prepared by chemical reduction method using silver nitrate, adipic dihydrazide and dextrose as the main raw materials. Nano-silver conductive inks were prepared by dispersing nano-silver particles in a specific proportion mixed solvent. Secondly, the nano-silver conductive ink was patterned by inkjet printing, and the morphology and conductivity of the nano-silver were studied. The effects of sintering temperature and sintering time on the resistivity of the inkjet printed electrodes were studied. The results showed that lower resistivity, the value was 0.34 mΩ·cm, could be obtained with sintering temperature raised up to 200°C, and the sintering time kept for 40 min.

Engineering,Chemistry,Materials Science
Direct pen writing and atomic-scale molecular dynamics simulation study of a novel silver nano-ink

Longchao Zhuo,Qinghao Wang,Jiacheng Sun,Yaoyao Feng,Enhuai Yin,Wen Liu,Bingqing Chen,Samuel Lin,Qiqi Zhang

DOI: https://doi.org/10.1007/s10854-023-11628-8

2023-11-19

Journal of Materials Science Materials in Electronics

Abstract:Herein, a facile synthesis approach for silver nanoparticles is disclosed through reduction action without the need for a peristaltic pump or inert gas shielding has been disclosed. Subsequent electron microscopy, X-ray diffraction, Ultraviolet–Visible spectroscopy and Fourier transform infrared spectroscopy were conducted to characterize the optimized nanoparticles with an average grain size of 29.9 nm. Employing a designed ink containing 35 wt% silver, four types of inks by direct writing showed different printability on the glass surface and conductive behavior. A resistivity value as low as 4.7 × 10 −7 Ω m was achieved following basic traditional sintering process at 250 °C for 30 min, along with stable electrical conductivity under repeated bending, suitable for bending in flexible electronic devices. Finally, molecular dynamics simulation was applied to gain a deeper understanding of the melting and sintering processes of Ag nanoparticles during the atomic-level bonding.

engineering, electrical & electronic,materials science, multidisciplinary,physics, condensed matter, applied
Optimized inkjet-printed silver nanoparticle films: theoretical and experimental investigations

Sreemannarayana Mypati,Shankar R. Dhanushkodi,Michael McLaren,Aristides Docoslis,Brant A. Peppley,Dominik P. J. Barz

DOI: https://doi.org/10.1039/c8ra03627f

IF: 4.036

2018-01-01

RSC Advances

Abstract:Systematic study of printing scheme and sintering time and temperature on the conductivity of silver flims on glass.

chemistry, multidisciplinary
High temperature-assisted electrohydrodynamic jet printing of sintered type nano silver ink on a heated substrate

Dazhi Wang,Qiang Wang,Qingbo Meng,Kai Li,Jingguo Li,Shenghu Xiong,Cui Liu,Xiao Yuan,Tongqun Ren,Junsheng Liang

DOI: https://doi.org/10.1088/1361-6439/ab0739

2019-03-12

Journal of Micromechanics and Microengineering

Abstract:Sintered type silver ink has been widely applied in photovoltaics and piezoceramics due to its unique electrical and mechanical properties. This study presents a high temperature-assisted electrohydrodynamic jet (HTAEJ) printing technique for direct printing high aspect ratio micro-scale silver structures using sintered type silver ink. It makes use of an external electrical field force to form a focused jet to produce fine features using a large sized nozzle. During the printing process, a certain temperature is necessary to accelerate evaporation of the solvent in the just printed structure, to hold its original printed feature. It was found that a high temperature of 200 °C generated by a heating substrate can help to produce fine silver structures using the electrohydrodynamic jet printing technique. A sintered type nano silver ink was prepared for HTAEJ printing. Unique equipment with a heating platform and a cooling fixture was designed and produced for HTAEJ printing of sintered type silver ink. Besides, the printing parameters of temperature, electric field strength and motion speed have been investigated to achieve a stable jet and desired printed silver structures. It was demonstrated that the HTAEJ printed silver structure has a width of 50 μm, an aspect ratio of 0.4 and a resistivity of 6.5 μΩ cm. Furthermore, 3D silver micro-pillars with a diameter of 20 μm and height of 80–120 μm were produced using the HTAEJ printing technique.

engineering, electrical & electronic,nanoscience & nanotechnology,instruments & instrumentation,physics, applied
Preparation of silver nanoparticles and application in water-based conductive inks

Y. Z. Zhao,D. X. Du,Y. H. Wang

DOI: https://doi.org/10.1142/S0217979219503855

2020-02-07

International Journal of Modern Physics B

Abstract:We reported a simple, high yield and large-scale preparation method for silver nanoparticles. Silver nanoparticles with 8–13 nm in diameter were successfully synthesized by silver nitrate as raw material, sodium borohydride as reducing agent, dispersan-5040 (polycarboxylate sodium salt) as surface modifier in aqueous solution. The effects of sodium borohydride and dispersan-5040 on the morphologies of silver nanoparticles were investigated. Further, the conductive inks were prepared with as-synthesized silver nanoparticles as conductive fillers in the presence of deionized (DI) water and additives. The effects of conductive fillers and additives on the pH, conductivity, surface tension and viscosity of the inks were investigated. The conductive patterns were fabricated by inkjet printer and their performances were studied. The sheet resistances of the printed pattern with seven-layer was 1.2 Ω/□ when the printed pattern was heat-treated at 120 ∘ C for 60 min. We succeeded in printing a simple conductive circuit on photographic paper, which can light three 0.06 W LED beads. The successful fabrication of the functional circuit proves the feasibility of the ink and provides some ideas for future paper-based circuits.

physics, condensed matter, applied, mathematical
Direct Writing Highly Conductive Silver Pattern on Flexible Substrate Based on Particle-Free and Ionic Liquid-Assisted Ink

Xiaosheng Xie,Zijian Wu,Daocheng Pan,Xinan Shi

DOI: https://doi.org/10.1088/1742-6596/2785/1/012111

2024-07-04

Journal of Physics Conference Series

Abstract:Particle-free silver inks have the advantage of low sintering temperature, high stability, and easy synthesis over traditional nanoparticle-based silver inks, which have been widely applied in the printing electronic industry. In this paper, we develop a novel particle-free and ionic liquid-assisted silver ink consisting of silver acetate and formic acid/iso-propanolamine liquid that can be used to print highly conductive silver patterns at low sintering temperatures. A variety of continuous and consistent silver circuits with a resistivity of 7.7 μΩ·cm can be printed by a dispenser machine, which is only 4.8 times bulk silver. Furthermore, the low-resistivity silver patterns can be also printed on the flexible polyimide foil, which maintains the stability of resistivity and mechanical properties after bending multiple times, demonstrating that our ionic liquid-assisted silver ink can be applied in flexible electronic devices. Besides, our particle-free silver ink can be utilized to write electric circuits directly with a ball-point pen.
An Approach to a Silver Conductive Ink for Inkjet Printer Technology

Svetlana N. Kholuiskaya,Valentina Siracusa,Gulnaz M. Mukhametova,Luybov A. Wasserman,Vladislav V. Kovalenko,Alexey L. Iordanskii

DOI: https://doi.org/10.3390/polym16121731

IF: 5

2024-06-19

Polymers

Abstract:Silver-based metal–organic decomposition inks composed of silver salts, complexing agents and volatile solvents are now the subject of much research due to the simplicity and variability of their preparation, their high stability and their relatively low sintering temperature. The use of this type of ink in inkjet printing allows for improved cost-effective and environmentally friendly technology for the production of electrical devices, including flexible electronics. An approach to producing a silver salt-based reactive ink for jet printing has been developed. The test images were printed with an inkjet printer onto polyimide substrates, and two-stage thermal sintering was carried out at temperatures of 60 °C and 100–180 °C. The structure and electrical properties of the obtained conductive lines were investigated. As a result, under optimal conditions an electrically conductive film with low surface resistance of approximately 3 Ω/square can be formed.

polymer science
An organic silver complex conductive ink using both decomposition and self-reduction mechanisms in film formation

Wendong Yang,Changhai Wang,Valeria Arrighi

DOI: https://doi.org/10.1007/s10854-017-8205-7

2017-11-10

Abstract:Flexible electronics is of considerable interest for many applications due to the distinctive features of low-cost, flexibility and light weight capabilities. However, in translating the technology from research to practical applications one faces many challenges. One of them is to formulate suitable ink materials where the selection of functional components, for example in the case of organic silver ink, the silver precursor, complexing agent and volatile organic solvent, are very critical because these constituents determine the final properties of the ink. In this paper, a new type of silver organic ink with decomposition and self-reduction mechanisms (10 wt% silver content) was formulated. It is shown that the ink is capable of producing silver films with good uniformity and conductivity on a polyimide substrate after sintering at 155 °C. The effect of solvent on the thermal property of the formulated ink have been investigated by differential scanning calorimetry (DSC) and UV–Vis spectrscopy, where the active roles of the solvents and the underlying chemical reactions in the ink during heating were studied. The reaction mechanism between the complexing agent and the silver precursor was confirmed by FT-IR measurements. The effects of sintering temperature and time on the microstructure and electrical properties of the silver ink films have been studied in detail using XRD, SEM/EDX and 4-probe based techniques. The defects such as voids and cracks as well as the coffee rings, which are often associated with films produced from organic silver inks, were reduced significantly by using both decomposition and self-reduction mechanisms in film formation.

engineering, electrical & electronic,materials science, multidisciplinary,physics, condensed matter, applied
Development of Silver Nanoparticle Ink for Printed Electronics

Yiliang Wu,Ping Liu,Tony Wigglesworth

DOI: https://doi.org/10.4071/isom-2012-wp51

2013-01-01

Journal of Microelectronics and Electronic Packaging

Abstract:Printable conductors with high conductivity would be critical for low-cost printed electronics. In view of printability, conductivity, and electrical stability, metal such as gold or silver derived from solution-deposited precursor compositions would be an ideal candidate. Xerox has been exploring the use of silver nanoparticles as conductor precursor composition for printed electronics. This paper reviews our research in the development of alkylamine-stabilized silver nanoparticles that can be sintered at low temperature (∼ 120 °C) for high conductivity (>10000 S/cm). Silver nanoparticle ink formulations based on these silver nanoparticles exhibit surface-energy independent printability which enables the fabrication of high-performance top-contact transistor devices, and self-assembly characteristic when printed on hydrophilic substrates which allows for large-area, defect-free source drain arrays to be printed with a narrow and uniform channel length.
(Invited) Opening Twisted Molecular Chains of High Solid Content Screen Printable Ink for Screen-Printed Low-Tortuosity Electrodes

Ying Wang,Hongli Zhu

DOI: https://doi.org/10.1149/ma2023-012535mtgabs

2023-08-28

ECS Meeting Abstracts

Abstract:Reducing the tortuosity of electrodes is an efficient technique for enhancing the charge transfer inside electrodes and boosting the fast-charging capabilities of lithium-ion batteries for electric vehicles. Compared to reported complex methods, screen printing is facile, economical, and printing pattern controllable. More importantly, the roll-to-roll screen printing equipment can be integrated into the existing electrode production system, allowing for the industrialization of low-tortuosity electrodes. However, the absence of screen-printable inks with a high solid content restricts the ink transfer volume per printing, lowering production efficiency and raising the price of screen-printed electrodes. By integrating rheological characteristics analysis, X-ray computed tomography characterization, and coarse-grained molecular dynamics (CGMD) simulation, we are able to recognize and illustrate the relevance of the molecular chain state in high-solid-content ink for screen printability. Additionally, we propose and develop a unique preparation procedure for producing high-solid-content screen-printable inks. In addition, the electrochemical performance of screen-printed electrodes was evaluated in order to enclose the importance of electrode micromorphology. This finding lays the door for the industrialization of screen-printable inks with high solid content and encourages additional research into screen-printed architectures with functional electrodes. In this work, we demonstrated for the first time that the molecular chains within high-solid-content inks should be untangled to obtain outstanding screen printability. Specifically, the twisted molecular chains serve as extra networks that drag certain particles within the electrode ink onto the mesh, hence diminishing its screen printability. Therefore, we suggest a two-step approach for opening the twisted molecular chains of inks with a high solid content of 60%. Employing this type of ink, the mass loading per printing layer elevates to about 5 times greater than the existing cathode inks. After opening the twisted chains, the LiNi 0.6 Mn 0.2 Co 0.2 O 2 cathode ink exhibited a lower viscosity, a faster thixotropic recovery, and superior screen printability than the ink containing twisted chains. Furthermore, due to the improved internal architectural integrity of screen-printed electrodes printed by the excellent screen-printability of ink, the electrode printed with optimized inks displayed a 33% larger charge capacity at 6C with a mass loading of 6.5 mg/cm2 than that produced with chains-twisted ink. In addition, based on the fundamental of the two-step approach, we present optimization approaches for altering screen-printable inks for a variety of circumstances. This idea could promote the coupling of screen printing with the production of functional electrodes and could be utilized for the production of screen-printable inks for all fields.
Research of 3D Printing Technology for Silver Paste based on Direct Ink Writing

Kun Jiao,E. Yin,Chao Li,Wenzhong Zhao,Lei Zhao

DOI: https://doi.org/10.1109/ICEPT56209.2022.9873368

2022-08-10

Abstract:Flexible electronics devices have many advantages, such as portability, transparency, good stretching and bending ability. In recent years, with the growing demand of the flexible electronics, it promoting the innovation of manufacturing method. Direct ink writing (DIW) is a low-cost, flexible and efficiency method to patterning conductive circuits on the flexible substrate. In this paper, Direct ink writing of commercial silver paste on PI substrates is introduced and the parameters that can be modified to tune the process include feed pressure, dispensing gap, moving speed and nozzle size are discussed. The results show that the commercial silver paste based on DIW method can obtain minimal trace width of 151μm on PI substrates under 0.11mm inner diameter nozzle, 100mm/min moving speed, 0.15Mpa feed pressure and 0.07mm dispensing gap. Then using the five-axis micro pen direct writing device developed by Ruite 3D, the silver paste pattern was successfully printed on the curved surface, which provided a useful reference for the subsequent application of the silver paste DIW technology in conformal antennas, flexible wearable devices and other 3D circuit fabrication directions.

Materials Science,Engineering
Reactive Silver Oxalate Ink Composition with Enhanced Curing Conditions for Flexible Substrates

Khushbu R Zope,Denis Cormier,Scott A Williams

DOI: https://doi.org/10.1021/acsami.7b19161

2018-01-31

Abstract:A solid silver-ligand complex, μ-oxolato-bis(ethylenediaminesilver(I)), was developed for formulating particle-free conductive metal-organic decomposition (MOD) inkjet inks. The complex comprises both a high molar silver content and solubility in inkjet compatible polar solvents. An aqueous ink formulation with 29.5 wt % silver content was developed and inkjet printed onto glass, polyethylene terephthalate, and polyimide substrates. A new hybrid thermal-photonic curing approach resulting in substantially improved electrical properties and substrate adhesion is presented. Silver conductive traces were measured to have bulk resistivity of 4.26 × 10-8 Ω m, which is 2.7 times that of bulk silver. One-pot complex synthesis yielded an easily isolated, and stable, solid product that can be formulated when needed thereby improving shelf life.
Synthesis and Characterization of Silver–copper Colloidal Ink and Its Performance Against Electrical Migration

Yi-Shien Li,Yu-Chieh Lu,Kan-Sen Chou,Feng-Jiin Liu

DOI: https://doi.org/10.1016/j.materresbull.2010.09.013

IF: 5.6

2010-01-01

Materials Research Bulletin

Abstract:This work developed a two-steps synthesis of silver–copper composite nanoparticles by dextrose reduction and with the addition of urea. Wherein, a part of the silver nanoparticles were prepared at first and were characterized by TEM image and EDX analysis, such that they could be the seeds for following the reduction of silver incorporated with copper in the colloids. In addition, the results of the study on thermal behavior of these kinds of particles has shown that with 5h-heating, the copper on the particle surface would be partially oxidized at 200°C, and complete oxidation of all the copper inside the composite occurred at 350°C. After proper purification and concentration, 20wt% Ag–Cu colloids as an ink was filled into a felt-tip pen and written on a substrate to make conducting lines. We also have demonstrated that the addition of copper to silver was helpful in reducing the electrical migration encountered by pure silver conducting lines.
Mesoscopic modeling of silver particles melting process on silicon wafer in inkjet-printed solar cell metallization

Lei Zhang,Enjian Yang,Yulin Miao

DOI: https://doi.org/10.1016/j.camwa.2023.12.018

IF: 3.218

2023-12-24

Computers & Mathematics with Applications

Abstract:Inkjet printing technology for solar cell metallization is considered as an important alternative with inherent non-contact characteristics. The melting process of silver particles plays the key role which determines the final structure of finger electrodes. To explore the melting of silver particles inside the silicon wafers , an enthalpy-based LB-FD model is presented to simulate the solid-liquid phase transitions in the multiphase system. In vertical thermal fields, silver particles melt from bottom to upper layers. The adhesion and coalescence behaviors of multiple particles are well captured in multiphase melting. The melting fluids near the sidewall are simulated with the interfacial tension and gravitational force. The effects of solid phase ratio and textured features of silicon wafers are also studied. The presented 3D enthalpy-based LB-FD model exhibits powerful capacities to solve the solid-liquid phase transitions in multiphase system. The numerical analysis provides a better insight to understand and improve the inkjet-printed solar cell metallization process.

mathematics, applied
Preparation of stable aqueous conductive ink with silver nanoflakes and its application on paper-based flexible electronics

Yanlong Tai,Zhenguo Yang

DOI: https://doi.org/10.1002/sia.3839

2012-01-01

Surface and Interface Analysis

Abstract:A new kind of stable aqueous conductive ink with silver nanoflakes was developed, which was also used to fabricate conductive patterns on weighing paper for flexible electronics by direct writing. Silver nanoflakes of different sizes were characterized by transmission electron microscopy. The physical properties of the conductive ink were investigated by a dynamic contact angle system, Ubbelohde viscometer, and a surface tension instrument. Conductive properties of paper-based conductive patterns were also investigated by 4-point probe, scanning electron microscopy, X-ray diffraction and Uscan explorer with a 3D profilometer system. It is demonstrated how the formulation of conductive ink affects the surface morphology, microstructure conductivity, and line width of conductive patterns. It can be obtained that the paper-based conductive patterns have low resistivity. Especially, when the sintering condition is 200 degrees C for 20 min, the resistivity can be down to 9.4 mu Omega.cm. The application of the ink on an antenna for radio frequency identification was also studied. Copyright (C) 2011 John Wiley & Sons, Ltd.
Investigation of Silver Conductive Ink Printable on Textiles for Wearable Electronics Applications: Effect of Silver Concentration and Polymer Matrix

Abdelkrim Boumegnane,Ayoub Nadi,Abdelouahed Dahrouch,Abdelhamid Stambouli,Omar Cherkaoui,Mohamed Tahiri

DOI: https://doi.org/10.1007/s12221-023-00276-8

IF: 2.5

2023-07-15

Fibers and Polymers

Abstract:This research paper presents the results of an investigation into the formulation of silver conductive ink for use in inkjet printing. The aim of the study is to develop an environmentally friendly and cost-effective ink using a simple and scalable method. To achieve this, silver nanoparticles (AgNPs) were synthesized through a co-reduction approach using starch and temperature, and their physical and chemical properties were examined. The silver conductive ink was prepared with different amounts of AgNPs, using a sodium alginate/ Polyethylene glycol (Na-alginate/PEG) suspension matrix. In order to ensure the suitability of ink for the inkjet printing technique, the viscosity measurement was performed. According to the results, three formulations were produced and printed on Polyurethane-coated polyester (PU-coated PET) by a syringe disposition system. The electrical measurements showed that the minimum sheet resistance of printed patterns prepared with 3%wt of AgNPs was 0.008 Ω/cm and 0.205 Ω/cm with 20wt% and 40wt% of Na-alginate, respectively. These values are sufficient to power an LED connected to the printed coated fabric. Furthermore, the electrical properties of the printed patterns remained acceptable for electronic applications even after mechanical stress up to 20%. This research has the potential to pave the way for several future applications of printed electronic textiles where environmentally friendly, low-cost, and higher electrical performance inks are required.

materials science, textiles,polymer science
An conductive ink based on silver oxide complex for low-temperature sintering with dense conductive paths

Miao Sun,Chunmei Li,Yuqing Xu,Baoping Lin,Xueqin Zhang,Ying Sun

DOI: https://doi.org/10.1007/s10854-024-12524-5

2024-04-13

Journal of Materials Science Materials in Electronics

Abstract:In the context of advancing flexible electronic technologies, conductive ink has garnered significant scholarly interest. Wherein, metal-organic decomposition (MOD) ink composed of silver precursors, complexing agents, and volatile organic solvents, has been widely studied due to its advantages such as simple preparation, long shelf life, high jetting stability, and low-temperature processing. However, the volumetric reduction of MOD ink frequently surpasses 80%, which typically could lead to multiple voids and breaks in the conductive film, resulting in poor conductivity. Meanwhile, a high temperature of above 180 °C is usually required for the MOD ink to be converted into conductive film. Nevertheless, it is imperative for the ink to be deposited onto substrates at low temperatures. Herein, a low temperature conducting ink with multiple silver source precursors has been developed. The results show that after sintering at 100 °C for 40 min on a polyimide (PI) substrate, the resistivity of the silver film was 16.8 μ Ω cm, which is only ten times higher than that of bulk silver, and the silver film with good uniformity and conductivity can be formed. Defects, such as voids and cracks, are significantly reduced through the gradient decomposition of different silver source during the sintering process. The formula of ink and the effects of sintering temperature on the microstructure and electrical properties of silver ink thin films have been studied in details using XRD, SEM, EDX, and four-probe techniques.

engineering, electrical & electronic,materials science, multidisciplinary,physics, condensed matter, applied
Grain Structure Engineering in Screen-Printed Silver Flake-Based Inks for High-Temperature Printed Electronics Applications

Arjun Wadhwa,Mohammad Saadati,Jaime Benavides-Guerrero,Martin Bolduc,Sylvain G. Cloutier

DOI: https://doi.org/10.3390/ma17204966

IF: 3.4

2024-10-12

Materials

Abstract:We extensively studied serigraphic screen-printed commercial silver flake inks loaded with silicon inclusions in order to achieve pinning at the grain boundaries. Based on grain size measurements using electron backscattered diffraction (EBSD), commercial silver ink with silicon microparticle content of 5 wt.% shows significant grain growth retardation compared to pristine silver ink, which stabilizes electrical conductivity up to 700 °C via a Zener pinning mechanism. The modified silicon-loaded silver ink experiences a two-times increase in grain size when heated up to 700 °C, compared to a seven-times increase for pristine silver ink. In turn, this enables operation temperatures significantly higher than the conventional operational window of microparticle-based silver inks, which are usually limited to 400 °C. Using isothermal exposures of 10 min up to 4 h, this phenomenon is observed at temperatures ranging from 250 °C to 900 °C. The electrical conductivity stability, grain size evolution and oxide contents were studied up to 4 h. The activation energy of silver ink with silicon inclusions is 54% lower than for pristine silver ink due to the pining effect, which retards grain growth via the Zener mechanism. Most importantly, the electrical resistivity remains stable up to 700 °C, which is more than twice the operation limit for off-the-shelf screen-printable silver flake inks. Hence, we demonstrate that adding controlled amounts of silicon particles to silver inks for grain structure engineering can open new vistas of possibilities for screen-printed metallic inks.

materials science, multidisciplinary,chemistry, physical,physics, applied, condensed matter,metallurgy & metallurgical engineering

In‐Depth Investigation of Inkjet‐Printed Silver Electrodes over Large‐Area: Ink Recipe, Flow, and Solidification

Preparation, Characterization and Reaction Mechanism of A Novel Silver-Organic Conductive Ink

Green Approach to Prepare Silver Nanoink with Potentially High Conductivity for Printed Electronics

Preparation of Nano-Silver Conductive Ink and Electrode Properties

Direct pen writing and atomic-scale molecular dynamics simulation study of a novel silver nano-ink

Optimized inkjet-printed silver nanoparticle films: theoretical and experimental investigations

High temperature-assisted electrohydrodynamic jet printing of sintered type nano silver ink on a heated substrate

Preparation of silver nanoparticles and application in water-based conductive inks

Direct Writing Highly Conductive Silver Pattern on Flexible Substrate Based on Particle-Free and Ionic Liquid-Assisted Ink

An Approach to a Silver Conductive Ink for Inkjet Printer Technology

An organic silver complex conductive ink using both decomposition and self-reduction mechanisms in film formation

Development of Silver Nanoparticle Ink for Printed Electronics

(Invited) Opening Twisted Molecular Chains of High Solid Content Screen Printable Ink for Screen-Printed Low-Tortuosity Electrodes

Research of 3D Printing Technology for Silver Paste based on Direct Ink Writing

Reactive Silver Oxalate Ink Composition with Enhanced Curing Conditions for Flexible Substrates

Synthesis and Characterization of Silver–copper Colloidal Ink and Its Performance Against Electrical Migration

Mesoscopic modeling of silver particles melting process on silicon wafer in inkjet-printed solar cell metallization

Preparation of stable aqueous conductive ink with silver nanoflakes and its application on paper-based flexible electronics

Investigation of Silver Conductive Ink Printable on Textiles for Wearable Electronics Applications: Effect of Silver Concentration and Polymer Matrix

An conductive ink based on silver oxide complex for low-temperature sintering with dense conductive paths

Grain Structure Engineering in Screen-Printed Silver Flake-Based Inks for High-Temperature Printed Electronics Applications