Application of Pure Water Circulation Cooling Device in Large-power Driving System

Qiang Guo-wen

Abstract:The principle of the pure water circulation cooling system used for the IGBT converter driving device with large power is presented. The experience and lessons in mounting and commissioning are expounded in detail.

Engineering

What problem does this paper attempt to address?

Water Cooling System Design and Thermal Analysis for Electrical Vehicle Driving Motors

HE Weichao,WU Jianhua

DOI: https://doi.org/10.3969/j.issn.1005-2895.2013.05.006

2013-01-01

Abstract:Aiming at the problem of serious temperature rise in high power density electric vehicle drive motor,a kind of high efficient parallel V-type water-cooling structure was researched.Based on the basic theory of hydromechanics and heat transfer,the 3D fluid and temperature fields were analyzed numerically by using the finite volume method.The fluid flow and heat transfer characteristics inside the water-cooling structure were described.Besides,the 3D steady thermal field of the motor was established and the result was solved.The heat transfer characters of the electrical motor and the thermal sensitivity to the height of the cooling ribs were analyzed.Finally,an experimental platform was established,and the test results verified the effectiveness of analysis.
A review of the cooling methods based on IGBT module and the application of micro-channel cooling in IGBT Chinese Full Text

WU Xilei,LI Chenyang,LIU Ying,YANG Jialiang,YAN Yuhao,ZHUANG Yuan,HAN Xiaohong

DOI: https://doi.org/10.13338/j.issn.1674-649x.2023.01.004

2023-01-01

Abstract:The thermal management problem of IGBT is becoming more and more prominent, and it is urgent to develop a new cooling technology with high efficiency, stability and flexibility.Based on the main problems and bottlenecks in the current IGBT module cooling, was conducted a detailed analysis and evaluation of the widely used IGBT cooling technologies, as well as spray cooling, jet impingement cooling technology and micro-channel cooling technology, which are the hot spots of the current research.It shows that compared with other cooling technologies, micro-channel cooling technology, especially microchannel flow boiling cooling technology, has the advantages of compact structure, strong heat transfer capacity, high heat transfer coefficient, less working fluid charge, and good temperature uniformity performance, which have great development prospects in the field of thermal management of electronic devices.Thus, in this paper, it was proposed that microchannel flow boiling cooling is an optimal solution to the thermal management of new electronic devices, which provides an important reference for the design and application of IGBT module heat sinks.
A Pure Water Circulation Cooling Device on Main Drive Converter of Aluminum Strip Hot Tandem Mill

Zhuo Hai-tao

Abstract:This paper describes a kind of pure water circulation cooling device used in the inverter based on electric and electron components IEGT(injection enhanced gate transistor),includes the principle of the cooling system,installation and adjustment,as well as the experience in the aspects of inspection and maintenance.

Materials Science,Engineering
THE DEVELOPMENT OF PURE WATER COOLING SYSTEM FOR HIGH POWER CONVERTER

Chen Jianye,Shen Yingkui,Chen Xizheng

DOI: https://doi.org/10.3321/j.issn:1000-1026.2000.23.010

2000-01-01

Abstract:The high power converter device adopts the full-closed pure-water-cycle cooling system, which can not only use the high dissipation efficiency of water fully, but also save water and electricity, reduce size and prevent pollution. The principles and the configuration of the above water-cooling system is discussed in detail in this paper, and this cooling system has been used in domestic-made ±20 Mvar STATCOM. The results of two-year practical operation show that such a system can meet the cooling demand of the high power converter. This project is the original Power Ministry Science and Technology Key Project.
Numerical Simulation of Forced Liquid Cooling System with Cold Plate for IGBT

Xiong-peng YANG,Lei ZHANG,Lun CAO,Ruo-qi CHEN

DOI: https://doi.org/10.3969/j.issn.1008-5300.2014.02.013

2014-01-01

Abstract:With the increase of the power density in power electronic equipment,heat dissipation design has become a key bottleneck in reliability design of the product. In this paper,with the numerical simulation of the forced liquid cooling system with cold plate as an example,the advantages of forced cooling system with cold plate,the principles and calculation method of its numerical analysis are introduced. The verification based on the specific thermal simulation of IGBT modules shows that the water cooling system enjoys the advantages such as high integration,high modularization,high heat dissipation efficiency,low energy consumption,low noise,low space requirement and so on. It can control the temperature of high-power IGBT modules well,and thus makes it sure that devices such as IGBT module can work with safety,reliability,stability,the low module failure rate and high overall reliability of the product.
Heat Dissipation Characteristics of IGBT Module Based on Flow-Solid Coupling

Lipeng Tan,Peisheng Liu,Chenhui She,Pengpeng Xu,Lei Yan,Hui Quan

DOI: https://doi.org/10.3390/mi13040554

IF: 3.4

2022-03-31

Micromachines

Abstract:With the increase of power level and integration in electric vehicle controllers, the heat flux of the key silicon-based IGBT (Insulated Gate Bipolar Transistor) device has reached its physical limit. At present, third-generation semiconductor devices including SiC MOSFETs (Metal-Oxide-Semiconductor Field-Effect Transistor) are gradually replacing the dominant IGBT module. The hybrid IGBT module consists of both and can improve the performance and reduce the cost of controllers. Limits due to the installation space, location, and other conditions in the car make it difficult to meet the requirements of controllers with an air-cooled heatsink due to their large size and limited heat dissipation capacity. A smaller and more powerful water-cooled heatsink case is required to ensure the heat dissipation of the IGBT in the controller. Based on previous experience in finite element numerical simulation, hydrodynamics calculation, and heat transfer calculation, ANSYS Workbench finite element software was used to analyze the thermal resistance of each structure inside the module and the heatsink structure. The fluid characteristics and heat transfer performance of three different flow channel structures were analyzed, and the design of the cooling flow fin was improved to provide a reference for the heat dissipation of the hybrid IGBT module.

chemistry, analytical,nanoscience & nanotechnology,instruments & instrumentation,physics, applied
Active Cooling Analysis Of The Micro Pump Used In Igbt Power Module

Ling Xu,Yang Zhou,Yang Zhang,Bulong Wu,Mingxiang Chen,Xiaobing Luo,Sheng Liu

DOI: https://doi.org/10.1109/ECTC.2012.6249133

2012-01-01

Abstract:The problem of heat dissipation of high power electronics such as IGBT (Insulated Gate Bipolar Transistors) has puzzled us for long time. If the heat generated from the chips could not be eliminated away from the devices, the failure rate would rise rapidly. To deal with this problem, the micro pumps along with the microchannel embedded in the DBC substrate are proposed to remove the heat actively with high efficiency. In this paper, a 1200V 75A IGBT module was chosen to be investigated. The configuration, basic property and function of micro pump was briefly described. Then, the internal structure and detailed component were investigated by the method of dissection. Moreover, a finite element model was built to analyze the thermal performance of the new IGBT module integrated with two different kinds of microchannels and the thermal perfermance of this new IGBT module is studied by CFD (computational fluid dynamics). As shown in the results, the temperature decreased to less than 100 degrees C. Besides, the temperature uniformity is around 1 degrees C, a significant advantage for long term reliability.
High Temperature Direct Double Side Cooled Inverter Module for Hybrid Electric Vehicle Application

Cyril Buttay,C. Mark Johnson,Jeremy Rashid,Florin Udrea,Gehan A. J. Amaratunga,Peter Tappin,Nicholas Wright,Peter Ireland,Takeo Yamamoto,Yuuichi Takeuchi,Rajesh Kumar Malhan

DOI: https://doi.org/10.4028/www.scientific.net/msf.556-557.709

2007-01-01

Materials Science Forum

Abstract:In this paper a novel approach to the design and fabrication of a high temperature inverter module for hybrid electrical vehicles is presented. Firstly, SiC power electronic devices are considered in place of the conventional Si devices. Use of SiC raises the maximum practical operating junction temperature to well over 200°C, giving much greater thermal headroom between the chips and the coolant. In the first fabrication, a SiC Schottky barrier diode (SBD) replaces the Si pin diode and is paired with a Si-IGBT. Secondly, doublesided cooling is employed, in which the semiconductor chips are sandwiched between two substrate tiles. The tiles provide electrical connections to the top and the bottom of the chips, thus replacing the conventional wire bonded interconnect. Each tile assembly supports two IGBTs and two SBDs in a half-bridge configuration. Both sides of the assembly are cooled directly using a high-performance liquid impingement system. Specific features of the design ensure that thermo-mechanical stresses are controlled so as to achieve long thermal cycling life. A prototype 10 kW inverter module is described incorporating three half-bridge sandwich assemblies, gate drives, dc-link capacitance and two heat-exchangers. This achieves a volumetric power density of 30W/cm3.
A Load Adaptive Intelligent IGBT Gate Drive

Guangyao Zhang,B. Junming Zhang,Shuai Shao,Wanyuan Qu

DOI: https://doi.org/10.23919/icpe2023-ecceasia54778.2023.10213896

2023-01-01

Abstract:Insulated gate bipolar transistor (IGBT) is widely used in high power electronics converters as the key devices. The reliability and efficiency of converters are highly related to the IGBTs. For converters with various loads and inverters whose transient power changes periodically, when the load current is high, the IGBT switching stresses are high due to the parasitic parameters. Thus, the switching speed should be controlled. But the switching stresses are low under light load, and the same switching stresses control method will lead to high switching losses, decreasing the converter efficiency. To solve the problem, this paper proposed a closed loop active gate drive based on adaptive control. The feedback parameter is adaptive to the load current to optimize the IGBT switching losses under various loads. Thus, the converter reliability and efficiency are both improved. And then a 5kW Buck converter prototype is built to verify the theoretical analysis.
A Cost-Effective Active Cooling Method: Thermal Performance and Cost Analysis

Sheng Liu,Ling Xu,Mingxiang Chen

DOI: https://doi.org/10.1109/esime.2012.6191805

2012-01-01

Abstract:This paper presents an active cooling method for power electronics devices especially for insulated gate bipolar transistors (IGBT) modules. This method is a kind of liquid cooling, which utilizes the excellent cooling ability of flowing water and bring the heat out of the module through the base plate embedded with micro-channel. Finite element analysis is used to judge the thermal performance, the highest temperature and the temperature uniformity are uniquely concerned. The results showed that this method could satisfy the heat dissipation need of devices with high power densities. Besides, this method relies on the performance, cost and reliability of the pump. A tiny and powerful micro pump would make this active cooling method become practical. However, this kind of micro pumps is usually very expensive. Thus the cost analysis was done to decide whether this kind of cooling method could be used widely in industry.
Advanced Active Gate Drive for Switching Performance Improvement and Overvoltage Protection of High-Power IGBTs

Fan Zhang,Xu Yang,Yu Ren,Lei Feng,Wenjie Chen,Yunqing Pei

DOI: https://doi.org/10.1109/tpel.2017.2716370

IF: 5.967

2018-01-01

IEEE Transactions on Power Electronics

Abstract:This paper presents a new active gate drive (AGD) for switching performance improvement and overvoltage protection of high-power insulated gate bipolar transistors (IGBTs). In addition to the conventional gate drive (CGD) based on fixed voltage sources and fixed gate drive resistors, the proposed AGD has a complementary current source to provide extra gate drive current into the gate. Specific transient switching stages of the IGBT can be therefore accelerated, leading to higher switching speed and lower switching loss of the IGBT. Additionally, the turn-off voltage overshoot of the IGBT can be controlled at a preset reference value with a fast closed-loop overvoltage protection circuit. Moreover, the switching speed of the IGBT, including the turn-on/off delay times and the turn-on/off voltage slopes, can be effectively regulated with an adaptive switching speed control method. Accordingly, the gate drive is capable of operating the IGBT at specified delay times and fixed voltage slopes when varying the switching conditions (e.g., temperature, load current). The operation principle of the proposed AGD and control concept are presented. By comparing with the CGD, the proposed method is experimentally verified on a 3.3 kV/1.5 kA IGBT module in both double-pulse and multipulse tests.
Water Cooling System for Converter ofMW-Class Wind Power Generators Adaptable to Extreme High Temperature Environment

LENG Ming-quan,ZHANG En-long,CHEN Jian-ye

DOI: https://doi.org/10.3969/j.issn.1004-9649.2012.08.019

2012-01-01

Abstract:In extreme high temperature environment,the heat dissipation efficiency of water cooling system for converter of MW-grade wind power generators designed for normal temperature environment decreases,which will cause the converter to be overheated and to operate incorrectly.An improved cooling system with an air cooling refrigeration unit combining vapor-compressed refrigerator in series with normal water cooling system is proposed.The heat exchange between the main water cycle of the converter and the refrigeration unit is realized through a cold storage water tank and an electric three-way valve,which could satisfy the heat dissipation requirement under extreme high temperature environment.When the environment temperature is above 45 centigrade degree and the thermal load is of 82 kW,the return water temperature will be below 46 centigrade degree.The heat release of the air radiator is only half of the output under normal temperature because of the refrigeration unit.In addition,because of the closed water cycle,water and energy are conserved in the proposed water cooling system.
Design and Implementation of the Compact Main Circuit of IGBT-based Converter

Wang Xuesong,Zhao Zhengming,Yuan Liqiang,Zhang Yingchao

DOI: https://doi.org/10.1109/vppc.2008.4677609

2008-01-01

Abstract:The compact main circuit has many advantages, such as reducing volume and weight, saving costs and convenient for transportation. This paper presents three key problems including switching power supply, sampling and protection system, and cooling system. Through simplifying circuit and optimizing device parameters, the switching power supply can provide multiplex regulated power supplies with 540 VDC input directly. A simple circuit based on ripple principle can detect missing phase of input fault easily. The heat sink can be designed in a small volume through selecting suitable cooling fans, reducing switching frequency and setting minimum pulse width. A 15 kW converter has been designed and implemented based on the above. Furthermore, this main circuit has been proved by practical application and long-term reliable operation.
Design and Application of External Cooling Water Saving Device in DC Converter Station

Tong-sen WANG,Hong-tao WANG

DOI: https://doi.org/10.19853/j.zgjsps.1000-4602.2010.04.023

2010-01-01

Abstract:According to the actual situation of external cooling water recycling system in direct current (DC) converter station, a water saving device was designed. The recycling use of external cooling water was realized by adding a counter flow cooling tower and electronic water treater for scaling. This device can decrease the discharge of external cooling water and reduce the risk for the normal operation of DC power transmission system due to disrupting of external water supply. It has good economic and social benefits and should be popularized.
Design of Heat Sink for Electric Vehicle SiC MOSFET Air-cooled Inverter

Chao LIU,Xiaoyu JIA,Changsheng HU,Min CHEN,Dehong XU

DOI: https://doi.org/10.13234/j.issn.2095-2805.2018.3.151

2018-01-01

Abstract:An electric vehicle driver inverter has a special request for high power density, and its thermal design directly affects the reliability of the electric driver system; meanwhile, the volume of cooling system also restricts the power density of the inverter. In this paper, based on a 20 kW electric vehicle SiC MOSFET air-cooled inverter, the relationship between the heat sink's thermal resistance and its geometric parameters is analyzed. On the premise of satisfying the cooling requirement of the inverter,the heat sink design,which includes the numbers of fans and heat sink channels, fin thickness and channel length, is performed. Moreover, the theoretical design was compared with thermal simulation and experiments,respectively.
Control Design of a Hydraulic Cooling Fan Drive for Off-Road Vehicle Diesel Engine with a Power Split Hydraulic Transmission

Feng Wang,Junyi Hong,Bing Xu,Wieslaw J. Fiebig

DOI: https://doi.org/10.1109/tmech.2021.3131572

2021-01-01

IEEE/ASME Transactions on Mechatronics

Abstract:The engine cooling fan drive is crucial for an engine as it ensures safe and efficient engine operation. In heavy-duty mobile machine, the engine cooling fan consumes a considerable amount of engine power. To meet high cooling demand a hydraulic fan drive is usually employed. A simple and cost-effective way is to use two fixed displacement hydrostatic units and a pressure relief valve where it has severe valve throttling losses. A more efficient way is to use a variable displacement pump to drive a fixed displacement motor. It eliminates valve throttling however the drive efficiency is still relatively low due to variable pump displacement control. Therefore, an engine cooling fan drive system with a power split hydraulic transmission was proposed in the previous study. The hydraulic transmission is a compact unit with both pumping and motoring functions. The fan speed is controlled by adjusting the transmission outlet pressure. Although previous results showed the system has relatively higher drive efficiency than conventional hydraulic fan drive at different fan speeds, the control design, and system dynamic performance have not yet been studied. Therefore, in this article, the control design of the cooling fan drive system with power split hydraulic transmission is studied. A feedforward controller based on transmission characteristics is designed to achieve better system performance. A hydraulic fan drive test bench is developed to evaluate system control design. The system dynamic performance with feedforward and feedback controls are compared through both simulation and experimental studies.
The application and research of the full-closed circulating water-cooling system in SVCs

Wen-wei WU,Zhi-min LU,Qing-yu KE,Hui-min LIU,Jian-guo MU,Jian-ye CHEN

DOI: https://doi.org/10.3969/j.issn.1004-9649.2006.05.008

2006-01-01

Abstract:An essential component for optimizing and safeguarding the operation of high power electronic equipment such as FACTS and HVDC is the cooling system.Pure-water cooling keeps vital PE components at the right temperature and prevents scaling.The operating experience of the water-cooling system of SVCs for the Lai Gang Group's 50t electric are furnace was introduced in the illustration of design parameters,operating principle,technical characteristics and actual operating situations of the full-closed circulating water-cooling system. The performance of the system proved that the full-closed circulating water-cooling system can provide a well heat-dissipating condition for the SVC.
Thermal Performance Optimization of Integrated Microchannel Cooling Plate for IGBT Power Module

Hanyang Xu,Jiabo Huang,Wenchao Tian,Zhao Li

DOI: https://doi.org/10.3390/mi14081498

IF: 3.4

2023-07-27

Micromachines

Abstract:In high-integration electronic components, the insulated-gate bipolar transistor (IGBT) power module has a high working temperature, which requires reasonable thermal analysis and a cooling process to improve the reliability of the IGBT module. This paper presents an investigation into the heat dissipation of the integrated microchannel cooling plate in the silicon carbide IGBT power module and reports the impact of the BL series micropump on the efficiency of the cooling plate. The IGBT power module was first simplified as an equivalent-mass block with a mass of 62.64 g, a volume of 15.27 cm3, a density of 4.10 g/cm3, and a specific heat capacity of 512.53 J/(kg·K), through an equivalent method. Then, the thermal performance of the microchannel cooling plate with a main channel and a secondary channel was analyzed and the design of experiment (DOE) method was used to provide three factors and three levels of orthogonal simulation experiments. The three factors included microchannel width, number of secondary inlets, and inlet diameter. The results show that the microchannel cooling plate significantly reduces the temperature of IGBT chips and, as the microchannel width, number of secondary inlets, and inlet diameter increase, the junction temperature of chips gradually decreases. The optimal structure of the cooling plate is a microchannel width of 0.58 mm, 13 secondary inlets, and an inlet diameter of 3.8 mm, and the chip-junction temperature of this structure is decreased from 677 °C to 77.7 °C. In addition, the BL series micropump was connected to the inlet of the cooling plate and the thermal performance of the microchannel cooling plate with a micropump was analyzed. The micropump increases the frictional resistance of fluid flow, resulting in an increase in chip-junction temperature to 110 °C. This work demonstrates the impact of micropumps on the heat dissipation of cooling plates and provides a foundation for the design of cooling plates for IGBT power modules.

chemistry, analytical,nanoscience & nanotechnology,instruments & instrumentation,physics, applied
Heat Dissipation Simulation Of Double-Sided Liquid-Cooled Igbt Module Package

Yuan Xu,Jie Bao,Renxia Ning,Li Hou,Zhenhai Chen,Wenyi Xu,Bin Zhou

DOI: https://doi.org/10.1109/ICEPT47577.2019.245119

2019-01-01

Abstract:In order to alleviate the pressure of energy and environment on human life and social development, the development of electric vehicle industry is very rapid. Insulated Gate Bipolar Transistor ( IGBT ) module with superior performance has become the core component of electric vehicle converter. But limited heat dissipation space and complex packaging structure will cause excessive local temperature of the IGBT chip, and then the chip damaged. Therefore, the packaging structure of IGBT module for efficient heat dissipation is the key to ensure the safe and reliable operation of converters and even electric vehicles. Based on the double-sided forced liquid-cooled packaging structure of high-power IGBT module, a three-dimensional coupled model of heat conduction and coolant flow was established in this paper. Pressure distribution of cooling medium and temperature distribution of chips and the radiator at different inlet flow rates are calculated. The maximum temperature of chip surface and pressure difference between inlet and outlet under different inlet flow rates are analyzed. The results show that when the inlet flow rate is relatively small, the larger the inlet flow rate, the better the heat dissipation effect, but the greater the flow resistance; when the inlet flow rate reaches a certain value, the increase of flow rate can only greatly increase the flow resistance, but the heat dissipation is not obviously improved; the heat dissipation effect of liquid cooled radiator is non-uniform, the chip temperature near the inlet is lower, and the chip temperature near the outlet is higher. Finally, in order to alleviate the local high temperature of the chip near the outlet, graphene-based films (GBFs) were applied to the chips surface near the outlet in this model. The simulation results show that the maximum temperature of the outlet chip decreases to a certain extent with the same fluidity.
High Power Snubberless IGBT Converter for Direct-Drive Wind Power Generation System

Li Ming,Wang Yue,Wang Bin,Zhang Leqiang,Liu Gang

2008-01-01

Abstract:With the development of renewable energy generation and the requirement for grid-connected distributed generation system, wind power system with full-size convertor becomes the fashion. A simple, close-loop but efficient snubberless method (AVRF) to suppress turn-off overvoltage in a 750 kW convertor using Infineon IGBT3 is showed, which makes the convertor compact and robust.

Application of Pure Water Circulation Cooling Device in Large-power Driving System

Water Cooling System Design and Thermal Analysis for Electrical Vehicle Driving Motors

A review of the cooling methods based on IGBT module and the application of micro-channel cooling in IGBT Chinese Full Text

A Pure Water Circulation Cooling Device on Main Drive Converter of Aluminum Strip Hot Tandem Mill

THE DEVELOPMENT OF PURE WATER COOLING SYSTEM FOR HIGH POWER CONVERTER

Numerical Simulation of Forced Liquid Cooling System with Cold Plate for IGBT

Heat Dissipation Characteristics of IGBT Module Based on Flow-Solid Coupling

Active Cooling Analysis Of The Micro Pump Used In Igbt Power Module

High Temperature Direct Double Side Cooled Inverter Module for Hybrid Electric Vehicle Application

A Load Adaptive Intelligent IGBT Gate Drive

A Cost-Effective Active Cooling Method: Thermal Performance and Cost Analysis

Advanced Active Gate Drive for Switching Performance Improvement and Overvoltage Protection of High-Power IGBTs

Water Cooling System for Converter ofMW-Class Wind Power Generators Adaptable to Extreme High Temperature Environment

Design and Implementation of the Compact Main Circuit of IGBT-based Converter

Design and Application of External Cooling Water Saving Device in DC Converter Station

Design of Heat Sink for Electric Vehicle SiC MOSFET Air-cooled Inverter

Control Design of a Hydraulic Cooling Fan Drive for Off-Road Vehicle Diesel Engine with a Power Split Hydraulic Transmission

The application and research of the full-closed circulating water-cooling system in SVCs

Thermal Performance Optimization of Integrated Microchannel Cooling Plate for IGBT Power Module

Heat Dissipation Simulation Of Double-Sided Liquid-Cooled Igbt Module Package

High Power Snubberless IGBT Converter for Direct-Drive Wind Power Generation System