Cryogenic Ferroelectric LiNbO3 Domain Wall Memory

Yi Ming Li,Bowen Shen,Di Hu,Jie Sun,A. Jiang
DOI: https://doi.org/10.1109/LED.2023.3346891
IF: 4.8157
2024-03-01
IEEE Electron Device Letters
Abstract:Non-volatile memory devices have become crucial components in emerging fields like integrated circuits and quantum computing. However, their cryogenic use remains a challenge today. Here we fabricated ferroelectric domain wall memory devices using an X-cut LiNbO3 (LNO) thin film on silicon, and their on/off currents after the creation and erasure of conducting domain walls between two antiparallel/parallel domains were investigated at low temperatures. The readout current is sufficiently larger than <inline-formula> <tex-math notation="LaTeX">$10~\mu \text{A}$ </tex-math></inline-formula>, though the domain wall current decreases nearly by a half upon cooling of the device from 300 to 120 K. The cryogenic memory has a large on/off ratio (<inline-formula> <tex-math notation="LaTeX">$10^{{4}}{)}$ </tex-math></inline-formula>, long retention time (>10 years) and high endurance cycles (<inline-formula> <tex-math notation="LaTeX">$10^{{9}}{)}$ </tex-math></inline-formula>, and can be applied at extremely harsh environments.
Engineering,Materials Science,Physics
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