Preparation of h-BN/SiCO ceramic matrix composites with high thermal conductivity and strength by vat photopolymerization 3D printing

Nannan Zhu,Yongzhao Hou,Lijuan Zhang,Guangwu Wen
DOI: https://doi.org/10.1016/j.jeurceramsoc.2024.03.007
IF: 5.7
2024-03-01
Journal of the European Ceramic Society
Abstract:In order to improve the performance of polymer-derived ceramics and expand its application field, the formulation of the photosensitive resin was further optimized and on the basis of modification, the two-dimensional filler h-BN was introduced in this paper. It was found that both the content of PVSA in the photosensitive resin and the introduction of h-BN had remarkable impacts on the properties of the polymer-derived ceramics. When the h-BN content in the PVSA photosensitive resin was 1wt%, the bending strength and fracture toughness of the ceramic sample after pyrolysis reached 252.4 ± 12.2MPa and 2.7 ± 0.2MPa·m1/2, respectively. With the increase of h-BN content, the thermal conductivity of the composite ceramics increased from 0.44W·m-1·K-1 to 5.34W·m-1·K-1. It is concluded that the thermal, electrical, and mechanical properties of precursor ceramics are improved by the introduction of two-dimensional fillers of h-BN.
materials science, ceramics
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