Fabrication and investigation of heat transfer behavior of copper nanofins by electrodeposition method in plate and frame heat exchangers (PHEs)

Nazanin Abdi,Mohammad Samipoorgiri,Alimorad Rashidi,Ashkan Zolriasatein
DOI: https://doi.org/10.1007/s10973-023-12610-6
IF: 4.755
2023-10-18
Journal of Thermal Analysis and Calorimetry
Abstract:Plate and frame heat exchangers are widely used nowadays, because their designed corrugations result in reducing the liquid turbulence to the counter current liquid flow and increasing heat transfer efficiency. In this manuscript, the effect of nanofin array coatings on the plates of a micro-channel heat exchanger with cross-flow configuration on overall heat transfer coefficient U-Value was studied. Six copper corrugated plates were installed in a micro-channel plate and frame heat exchanger. Nanofin arrays were synthesized by electrodeposition method. The dendritic copper nanofin array grew on the copper plates from electrolyte solution along with applying an increasing current in a specified time. The morphology of coatings on the plate surface was examined by SEM, and AFM technique. The cold and hot water with a predetermined inlet temperature for both hot and cold side circulated in the microchannel and U-Value was measured thereupon, the measured temperature difference was between 1.9 and 4.8 °C showing an increase of 41–135% in the U-Value compared to the non-coated versions of the plates.
chemistry, physical, analytical,thermodynamics
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