Abstract:The rapid development of high-performance portable electronics requires ultra-thin heat pipes (UTHPs) with higher heat transfer capacity to meet their heat dissipation needs. Wick structure, the key component of a heat pipe, makes a decisive role in the heat transfer capacity of the heat pipe. However, since the wall thickness of UTHPs is typically < 0.1 mm, it is difficult to machine deep enough grooves on the shell to increase the permeability of the wicks like conventional heat pipes. Therefore, a novel composite wick structure with high permeability for UTHPs is proposed in this study. It is found that the wick with larger pores formed by parallel woven spiral meshes have higher permeability, resulting in more working fluid in the wick, which helps delay the drying out at the evaporation end of heat pipes. To further improve the capillary performance of wicks, the effect of thermal oxidation suitable for mass production on the capillary pumping performance of wicks is systematically studied for the first time. Compared with the single sintered wick, the capillary rise height after oxidation at 400 °C, 500 °C, 600 °C, and 700 °C for 150 min increased by about 32.2%, 19%, 19.5%, and 12.9%, respectively. Considering that the copper oxidation may limit the choice of working fluid for the heat pipe, the wicks are heated to 400 °C for reduction reaction for 1 h (with 95% N2+5% H2 gas). The results show that the capillary rise height of the wicks after oxidation at 400 °C, 500 °C, 600 °C, and 700 °C and reduction treatment is about 110%, 127%, 114%, and 91.4% of that of the single sintered wick, respectively. The experimental results show that the maximum heat load power of the UTVCs with 5 layers #200 mesh, single sintered composite wick and 500 °C oxidation–reduction wick are 16 W, 29 W and 38 W, respectively.

Effect of Low-Temperature Thermal Oxidation on the Capillary Performance of Sintered Copper Powder Wicks

Effects of Fe-Al-Mo Penetrant on Resistance to Oxidation for Infiltrated Layer of Red Copper

Fabrication and capillary performance of a novel composite wick for ultra-thin heat pipes

Effect of Fabrication Parameters on Capillary Performance of Composite Wicks for Two-Phase Heat Transfer Devices

Characterization of capillary performance of composite wicks for two-phase heat transfer devices

Thermal performance enhancement of an ultra-thin flattened heat pipe with multiple wick structure

Experimental Investigation of Effective Thermal Conductivity for LHP Wicks

Enhanced Anti-Oxidation Copper-Based Conductive Inks for Low Porosity Copper Films in Power Electronics

Effect of Copper Content on the Microstructure and Properties of the Sintered Porous Aluminum Wick

Enhanced capillary performance of nanostructures copper woven mesh wick for ultrathin heat pipes

Biomimetic Copper Forest Structural Modification Enhances the Capillary Flow Characteristics of the Copper Mesh Wick

Reduction of effective thermal conductivity for sintered LHP wicks

Modification and Pool Boiling Performance Elevation of Copper Foam Wicks for High Power Applications

Fabrication and capillary characterization of multi-scale micro-grooved wicks with sintered copper powder

Evaporation/boiling heat transfer on capillary feed copper particle sintered porous wick at reduced pressure

EFFECTIVE THERMAL CONDUCTIVITY OF LOOP HEAT PIPE WICKS

Experimental and Theoretical Study on Performance of Bi-Porous Wick for Passive Phase-Change Devices

A Novel Antioxidation Treatment Method for Micron/Nano Copper Materials in Semiconduct Field

Experimental study on capillary performance of sintered powder porous wick for loop heat pipes

Experimental study on thermal performance of ultra-thin heat pipe with a novel composite wick structure

Improving the Oxidation Resistance of Polyphenylene Sulfide Fibers by Doping Copper Nanoparticles Loaded Halloysite Nanotubes