Abstract:Polyimide (PI) materials have found widespread utilization in advanced electronic systems. PIs with enhanced out-of-plane thermal conductivity (K ⊥) are urgently required to address the rising need for heat dissipation. However, their production remains a formidable challenge due to the difficulty of constructing heat transmission channels along the thickness direction. This study introduces an innovative approach to enhance the K ⊥ values of PI-based composites by utilizing binary fillers to construct an inter-external dual heat conduction network. To achieve this, we first prepared PI/reduced graphene oxide (rGO) hybrid microspheres via solution mixing and precipitation. The microspheres were then coated with boron nitride nanosheets (BNNS) by self-assembly to form a core-shell architecture. This assembly undergoes further refinement via cold-pressing and subsequent densification through hot-pressing, ultimately producing the (PI/rGO)@BNNS composites. This strategy improved K ⊥ values significantly, with a 13-fold and 3-fold increase in the K ⊥ value (3.98 W m−1 K−1) in comparison to pure PI (0.31 W m−1 K−1) and the random distribution composite (1.45 W m−1 K−1), respectively. The finite element analysis confirmed that the synergistic effect of rGO inside the PI phase and BNNS outside the PI phase greatly increased the heat transfer in PI-based composites. When utilized as a thermal interface material (TIM) for LED bulbs, the (PI/rGO)@BNNS composites exhibit an excellent heat dissipation capacity. Additionally, the prepared composites also maintain electrical insulation and present a reduced coefficient of thermal expansion. Overall, our work provides a simple and efficient technique for enhancing the out-of-plane thermal conductivity and maintain the electrical insulation of high-performance PI-based materials, which could have broad application potential in next-generation electronic devices.

Simultaneously Enhanced In-Plane and Out-of-Plane Thermal Conductivity of a PI Composite Film by Tetraneedle-like ZnO Whiskers and BN Nanosheets

Enhanced out-of-plane thermal conductivity of polyimide composite films by adding hollow cube-like boron nitride

Synergistic Improvement in Thermal Conductivity of Polyimide Nanocomposite Films Using Boron Nitride Coated Copper Nanoparticles and Nanowires

Enhancing out-of-plane thermal conductivity of polyimide-based composites via the construction of inter-external dual heat conduction network by binary fillers

Polyhedral oligosilsesquioxane-modified boron nitride enhances the mechanical properties of polyimide nanocomposites

Enhanced in-plane thermal conductivity of polyimide-based composites via in situ interfacial modification of graphene

Largely improved thermal conductivity of PI/BNNS nanocomposites obtained by constructing a 3D BNNS network and filling it with AgNW as the thermally conductive bridges

Improving in-plane and out-of-plane thermal conductivity of polyimide/boron nitride film with reduced graphene oxide by a moving magnetic field induction

Synergistic effects of boron nitride sheets and reduced graphene oxide on reinforcing the thermal conduction, SERS performance and thermal property of polyimide composite films

Enhanced thermal conductivity of carbon nitride-doped graphene/polyimide composite film via a “deciduous-like” strategy

High Electrical and Mechanical Properties Obtained in A Polyimide Based Nanocomposite with Sandwich Structure via Multi‐Dimensional Design

Covalent Bond-Assisted Continuous Interface Structure for High Thermal Conductive Polyimide Composite Films

Greatly enhanced thermal conductivity of polyimide composites by polydopamine modification and the 2D-aligned structure

Alkylated modified boron nitride nanosheets/polyimide composite films with advanced thermal conductivity and low dielectric constant

Preparation of Polyimide Composites Reinforced with Oxygen Doped Boron Nitride Nano-Sheet As Multifunctional Materials

Electrostatic self‐assembly of barnacle‐like modified BN@ND hetero‐structured fillers to synergistic enhanced thermal conductivity of PI composite films

Eco-friendly preparation of polyimide/boron nitride composite films with excellent thermal conductivity and mechanical properties

Imidization-Induced Carbon Nitride Nanosheets Orientation Towards Highly Thermally Conductive Polyimide Film With Superior Flexibility And Electrical Insulation

Multifunctional boron nitride nanosheets/fluorinated‐polyimide composites with ultra‐low dielectric constant and high thermal conductivity

Vacuum filtration-assisted design of hierarchical structure in polyimide-BN composite films: Toward enhanced thermal conductivity, low dielectric and electrical insulation

Preparation of highly thermally conductive and electrically insulating PI/BNNSs nanocomposites by hot-pressing self-assembled PI/BNNSs microspheres