Laser-Induced Corrugated Graphene Films for Integrated Multimodal Sensors
Qiushi Li,Tongyu Wu,Wei Zhao,Jiawen Ji,Gong Wang
DOI: https://doi.org/10.1021/acsami.1c12686
2021-07-29
Abstract:Microstructures play a dominant role in flexible electronics to improve the performance of the devices, including sensitivity, durability, stretchability, and so on. However, the complicated and expensive fabrication process of these microstructures extremely hampers the large-scale application of high-performance devices. Herein, we propose a novel method to fabricate flexible graphene-based sensors with a 3D microstructure by generating laser-induced graphene (LIG) on the 3D printed polyether ether ketone corrugated substrate, which is referred to as CLIG. Based on that, two integrated piezoresistive sensors are developed to monitor the precise strain and pressure signals. Contributed to the 3D corrugated graphene structure, the sensitivities of strain and pressure sensors can be up to 2203.5 and 678.2 kPa–1, respectively. In particular, the CLIG-based strain sensor exhibits a high resolution to the microdeformation (small as 1 μm or 0.01% strain) and remarkable durability (15,000 cycles); meanwhile, the pressure sensor presents a remarkable working range (1–500 kPa) and fast response time (24 ms). Furthermore, the CLIG-based sensors provide a stable data source in the applications of human-motion monitoring, pressure array, and self-sensing soft robotic systems. High accuracy allows CLIG sensors to recognize more subtle signals, such as pulse, swallowing, gesture distinction of human, and movement status of soft robotics. Overall, this technology shows a promising strategy to fabricate high-performance sensors with high efficiency and low cost.The Supporting Information is available free of charge at https://pubs.acs.org/doi/10.1021/acsami.1c12686.Schematic of the fabricating process of the CLIG film, surface morphology of the 3D printed waved PEEK substrate with different speeds, Raman spectrum of LIG under different scanning times on the waved PEEK substrate, material curve of PDMS, finite element simulation, simulated physical models of CLIG and LIG sensors, enlarged cracks shown in Figure 3c, growth of cracks on CLIG and LIG, comparison between CLIG and LIG strain sensors, contact resistance calculation of the CLIG pressure sensor, calculation of resistance of the representative unit of the pressure sensor, combination of strain and pressure sensors in a single mechanical finger, and details of 3D printing parameters of the PEEK substrate (PDF)Video of the flexibility and robustness of the CLIG film (MP4)Video of the conformal pressure array (MP4)Video of the self-sensing robotic system (MP4)This article has not yet been cited by other publications.
materials science, multidisciplinary,nanoscience & nanotechnology