Abstract:Amid the ongoing emphasis on reducing manufacturing costs and enhancing productivity, one of the crucial objectives when manufacturing is to maintain process tools in optimal operating conditions. With advancements in sensing technologies, large amounts of data are collected during manufacturing processes, and the challenge today is to utilize these massive data efficiently. Some of these data are used for fault detection and classification (FDC) to evaluate the general condition of production machinery. The distinctive characteristics of semiconductor manufacturing, such as interdependent parameters, fluctuating behaviors over time, and frequently changing operating conditions, pose a major challenge in identifying defective wafers during the manufacturing process. To address this challenge, a multivariate fault detection method based on a 1D ResNet algorithm is introduced in this study. The aim is to identify anomalous wafers by analyzing the raw time-series data collected from multiple sensors throughout the semiconductor manufacturing process. To achieve this objective, a set of features is chosen from specified tools in the process chain to characterize the status of the wafers. Tests on the available data confirm that the gradient vanishing problem faced by very deep networks starts to occur with the plain 1D Convolutional Neural Network (CNN)-based method when the size of the network is deeper than 11 layers. To address this, a 1D Residual Network (ResNet)-based method is used. The experimental results show that the proposed method works more effectively and accurately compared to techniques using a plain 1D CNN and can thus be used for detecting abnormal wafers in the semiconductor manufacturing industry.

A Copula network deconvolution-based direct correlation disentangling framework for explainable fault detection in semiconductor wafer fabrication

An adaptive Copula function-based framework for fault detection in semiconductor wafer fabrication

Fault Detection Using Random Projections and k-Nearest Neighbor Rule for Semiconductor Manufacturing Processes

Fault Detection and Isolation Methods in Subsea Observation Networks

Random projection based k Nearest Neighbor rule for semiconductor process fault detection

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DSCU-Net: MEMS Defect Detection Using Dense Skip-Connection U-Net

A Novel Approach of Feature Extraction for Analog Circuit Fault Diagnosis Based on WPD-LLE-CSA

A novel joint segmentation approach for wafer surface defect classification based on blended network structure

A Fault Prognosis Strategy Based on Time-Delayed Digraph Model and Principal Component Analysis

Application of 1D ResNet for Multivariate Fault Detection on Semiconductor Manufacturing Equipment

Multiway Principal Polynomial Analysis for Semiconductor Manufacturing Process Fault Detection

A novel decoupling method of compound faults with incomplete dataset of rotating machinery

Utilization of Machine Learning and Explainable Artificial Intelligence (XAI) for Fault Prediction and Diagnosis in Wafer Transfer Robot

Causality-embedded Reconstruction Network for High-Resolution Fault Identification in Chemical Process

Deformable Convolutional Networks for Efficient Mixed-Type Wafer Defect Pattern Recognition

Machine Learning-Based Detection Method for Wafer Test Induced Defects

Machine Learning Based Wafer Defect Detection

Development of Fault Detection Systems Based on Big Data Ecosystem in Semiconductor Manufacturing: The Hadoop Ecosystem Implementation

Feature selection and interpretability analysis of compound faults in rolling bearings based on the causal feature weighted network