Abstract:INTRODUCTION With the ever increasing applications of miniaturized components with high accuracy in a variety of fields, the micromachining process has gained significant importance over the last decade. Researchers have reached the consensus that high aspect ratio and complex geometry 3D structures (made of a variety of materials) are very important. At present, a limited number of technologies retain the capability of manufacturing micro-scale complex 3D shapes with high aspect ratios. In particular, etching-based processes are mainly used to machine silicon and silicon-like materials for MEMS related applications. However, these processes are basically planar 2.5D processes. On the other hand, micro-milling, which is essentially a scaling version of conventional milling processes, represents the most powerful process in terms of versatility and obtainable shapes and features. As the size of the tool and material removal unit are downscaled, there are several critical issues associated with micromachining and machine tools, which are mainly from the increased requirement of positioning accuracy and rotational speed. The whole volume of material removal is small in comparison to the conventional machining process, while higher tool deflections, high tool wear and high risk of tool breakage are often observed, especially for hard work materials. In die/mold industries, more and more hard materials with high strength are recently used to increase the life of molds, which makes the micromachining process even more challenging. Simultaneously, in order to successfully remove the product, micro-injection molds should have a surface finish Rz equal or less than 1.0 μm. To meet the ongoing performance requirements, the extensive investigation and understanding of the micro-milling process is essential in order to control and improve process capability. When the chip thickness is comparable in size to the tool edge radius, the bluntness associated with the tool edge creates a ‘ploughing’ action, which is different from shearing, which is the primary mode of chip formation in micromachining. Ploughing is considered to be a plastic deformation process where there is displacement of asperities between the two interlocking surfaces. Researchers argued that the total force or specific cutting energy had contributions both from the shearing action and the ploughing action. The specific cutting energy increases with a decrease in the undeformed chip thickness; this is commonly referred to as the “size effect”. There are many theories explaining the reasons for the existence of the size effect. Among them are the effect of tool edge radius that causes ploughing, material strengthening effects, subsurface plastic deformation and material separation [1]. The extent of ploughing/rubbing and the nature of the micro-deformation contribute significantly to increased cutting forces [2], burr formation [3] and increased surface roughness [4, 5].

Modeling and investigation of minimum chip thickness for silicon carbide during quasi-intermittent vibration–assisted swing cutting

Undeformed chip thickness with composite ultrasonic vibration-assisted face grinding of silicon carbide: Modeling, computation and analysis

Research on the minimum cutting thickness of variable density micro-texture ball-end milling cutter

Optimization of Tool Wear and Cutting Parameters in SCCO2-MQL Ultrasonic Vibration Milling of SiCp/Al Composites

Analytical modeling of subsurface damage and material removal energy in elliptical vibration cutting of micro-structures on brittle materials

Investigation on the cutting mechanism of SiCp/Al composites in ultrasonic elliptical vibration machining

On understanding the cutting mechanism of SiCp/Al composites during ultrasonic elliptical vibration-assisted machining

On ductile-regime elliptical vibration cutting of silicon with identifying the lower bound of practical nominal cutting velocity

Cutting Force Model of Ultrasonic Elliptical Vibration-Assisted Helical Milling of SiCp/Al Composites

Modeling and investigation of cutting force for SiCp/Al composites during ultrasonic vibration-assisted turning

On ductile-regime elliptical vibration cutting of silicon with identifying the lower bound of practicable nominal cutting velocity

Modeling of minimum chip thickness in micromachining of hard tool steels with the modified slip line model

Precision Grinding Technology of Silicon Carbide (SiC) Ceramics by Longitudinal Torsional Ultrasonic Vibrations

A Numerical Analysis of Ductile Deformation during Nanocutting of Silicon Carbide via Molecular Dynamics Simulation

Simulation and experimental study on limited cutting and heat effect of silicon carbide

Investigation Of The Size Effect On Burr Formation In Two-Dimensional Vibration-Assisted Micro End Milling

Experimental study on cutting force and surface quality in ultrasonic vibration-assisted milling of C/SiC composites

Experimental Study on the Minimum Undeformed Chip Thickness Based on Effective Rake Angle in Micro Milling

Multidimensional ultrasonic vibration machining modeling of SiCp/Al cutting forces with different volume fractions: Experiments and numerical simulations

Influence of Vibration Inclination on Surface Quality and Tool Wear by Ultra-Precision Vibration-Assisted Cutting

Effects of minimum uncut chip thickness on tungsten nano-cutting mechanism