Using the Test Guardband Estimation Method to Forecast Future Semiconductor Yield Trends
Chung-Huang YehJwu E. Chen1 Intelligent Manufacturing Engineering,Minth University of Science and Technology,No.1.Ta Hwa Rd,Chiung-Lin,307,Hsin-Chu,Taiwan2 Electrical Engineering Department,National Central University,No.300,Jhongda Rd.,Jhongli City Taoyuan County,Taoyuan City,TaiwanChung-Huang Yeh was born in Taipei,Taiwan,ROC.,on March 20,1972. His research interests are in reliability and test quality of circuits.Jwu E Chen was born in Pingtung,Taiwan,ROC.,on December 18,1961. His research interests are in reliability,fault tolerant and test quality of circuits. E-mail:
DOI: https://doi.org/10.1080/03772063.2024.2310125
IF: 1.8768
2024-02-03
IETE Journal of Research
Abstract:Semiconductor manufacturing and technology testing are developing at different speeds, and yield loss due to inaccuracies in the testing process has become an important issue. The integrated circuit test model is applied in this study using an iterative yield prediction method (IYP) to estimate the fabrication yield of future wafers based on their process parameters and electrical characteristics. Additionally, test guardband estimation (TGE) method is proposed to adjust the test guardband to maintain the desired product quality after testing. The proposed iterative yield prediction method is demonstrated using a set of parameters from the IEEE International Roadmap for Devices and Systems (IRDS) 2021. Evaluation of the specifications in the IRDS table reveal shows that IYP can demonstrate the appropriate yield curve as predicted.
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