Interfacial microstructure of multi-layered Al-Cu joint by Electromagnetic Pulse Welding

Yan Zhou,Chengxiang Li,Ting Shen,Dan Chen,Xianmin Wang,Yugui Ma
DOI: https://doi.org/10.1016/j.jmrt.2023.06.034
IF: 6.267
2023-06-10
Journal of Materials Research and Technology
Abstract:The necessity of the multi-layered aluminium (Al) tabs to copper (Cu) busbars for electric vehicle (EV) batteries is increasing. Electromagnetic pulse welding (EMPW) is applicable to the welding of conductive dissimilar/similar materials. In this work, three Al sheets and a single Cu sheet are joined by the EMPW technology. The layer-wise tensile lap shear properties of the multi-layered Al-Cu EMPW joint are evaluated. The layer-wise interfacial microstructures of the joint parallel to and perpendicular to the welding direction are studied by scanning electron microscopy (SEM) and transmission electron microscopy (TEM) and energy-dispersive spectroscopy (EDS). The results showed that every layer achieved metallurgical bonding. The Al sheets were formed to be whole. There were three types of interfaces at the Al-Cu interface parallel to the welding direction: flat interface, wave interface, and irregular wave interface. The transition zone is found at the Al-Cu interface perpendicular to the welding direction. Due to the impact, the grains near the Al-Cu interface and Al-Al interface are both refined. Thus, the well-bonded multi-layered Al-Cu joint is successfully obtained via EMPW. The results can offer help in the manufacturing of EVs.
materials science, multidisciplinary,metallurgy & metallurgical engineering
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