Microstructure evolution and mechanical properties of Al/Cu ultrasonic spot welded joints during thermal processing
Sansan Ao,Chunjie Li,Wei Zhang,Manpeng Wu,Yu Dai,Yao Chen,Zhen Luo
DOI: https://doi.org/10.1016/j.jmapro.2019.04.006
IF: 5.684
2019-05-01
Journal of Manufacturing Processes
Abstract:<h2>Abstract</h2><p>As a new type of solid-state welding technique, ultrasonic spot welding (USW) is a promising technique for joining Al to Cu. However, the properties of the Al/Cu dissimilar joints could be affected when exposed to high temperature environments due to the resistance heat and environmental heat in the service process. In this work, USW was used to join commercially pure Al to Cu, and the joints were thermally processed at different temperatures for different holding times. The joint formation mechanism, interface characteristics, and the mechanical properties of the dissimilar joints were characterized. The results have shown that higher temperatures and longer holding times promote the inter-diffusion of Al and Cu atoms, thereby enhancing the formation and growth of intermetallic compounds (IMCs). At the temperature of 150 °C, IMCs were not observed at the Al/Cu interface over the range of holding times investigated, indicating that the Al/Cu USW dissimilar joints can be used in working environments with temperatures below 150 °C. At higher temperatures, different types of IMCs (Al<sub>2</sub>Cu, AlCu, and Al<sub>4</sub>Cu<sub>9</sub>) were formed at the Al/Cu interface. The thickness of the IMCs was found to increase with increasing temperature and holding time. Consequently, the ultimate tensile load of the joints decreased sharply, and the fracture mode changed from pullout fracture to interfacial fracture.</p>
engineering, manufacturing