A low‐profile wide‐angle scanning ultrawideband tightly coupled dipole array without any wide‐angle impedance matching layer

Yuan Geng,Deqiang Yang
DOI: https://doi.org/10.1049/mia2.12350
2023-03-08
Abstract:A low profile lightweight wide‐angle scanning ultrawideband TCDA without WAIM is proposed. The array achieves a good performance of the impedance bandwidth (0.67–2.83 GHz) and wide‐angle scanning ability (±75°in the E‐plane and ±45° in the H‐plane) when the VSWR<3. Moreover, the overall profile of the presented array is only 0.058λ_low. The present is a low‐profile, wide‐angle scanning, ultrawideband, tightly coupled dipole array that lacks a wide‐angle impedance matching layer and lossy materials. Impedance matching will deteriorate at the lower end of the operating bandwidth due to the influence of the ground plane. A well‐designed perforated balun is used to achieve better impedance matching. Moreover, parasitic metallic strips are attached to the dipole's side to add additional reactive components. According to the results of simulations, the impedance bandwidth of the array, which ranges from 0.67 to 2.83 GHz, and its wide‐angle scanning capability, which scans 75° in the E‐plane and 45° in the H‐plane, both achieve good performance when the voltage standing wave ratio is less than 3. The profile of the array is only 0.0581λlow above the ground plane, where λlow is the wavelength at the lowest operating frequency. The proposed array's simulated results are validated by fabricating and measuring an 8 × 8 prototype array.
telecommunications,engineering, electrical & electronic
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