Abstract:Morphology of metal/polymer composite and resistance as function of deposition time. In this study, the impact of three different principles of surface activation techniques for polyamide fibers on the formation of conductive percolation during the subsequent electroless copper deposition process was investigated. The techniques used are (1) polyamide complexation using a solution mixture of calcium chloride, ethanol and water, (2) atmospheric plasma surface treatment and (3) grafting of 2‐hydroxyethylmethacrylate by radical induced polymerization. As a result, the percolation threshold was shifted to lower copper contents. The copper content required to form conductive structures was reduced ranged between 59% and 89%, depending on the activation techniques. Furthermore, the deposition time was reduced by 37%–57%, resulting in a faster build‐up of the percolation on the fabric. Changes in wetting behavior and substrate surface topography were identified to be the main reasons for these observations. While all applied surface activation techniques led to higher copper contents compared to unmodified reference, the atmospheric plasma modification led to the highest copper contents during the deposition process and a more uniform appearance of the metallised layer. Highlights Three different fiber surface activation methods are evaluated. Fiber surface activation increases wetting and polymer‐metal adhesion. Activated polymer surface leads to faster copper deposition and percolation. Atmospheric plasma modification is the most efficient technique.

UV-induced graft polymerization of polyamide-6 for electroless copper deposition

Electroless Plating of Copper via a Sn-Free Process on Dielectric SiLK Surface Modified by UV-Induced Graft Copolymerization with 4-Vinylpyridine and 1-Vinylimidazole

Electroless Copper Plating on PC Engineering Plastic with a Novel Palladium-Free Surface Activation Process

Altering the percolation threshold of PA66‐copper hybrid in an electroless copper deposition process by surface activation of the polymer

PET Surface Modification with Inkjet-Printing Pd 2+ /Epoxy Resin Solution for Selective Electroless Copper Plating

Chemical preparation of Pd nanoparticles in room temperature ethylene glycol system and its application to electroless copper deposition

Polymer Brush Induced Electroless Copper Plating on PA12 Surface for Tensile Strength Enhancement of Selective Laser Sintering Part

Modification of Cu Nanoparticles with A Disulfide for Polyimide Metallization

Electroless Deposition: A Superficial Route to Synthesis of Highly Conductive Electrospun Nylon 6 Nanofibers

Electroless Copper Plating on 1,2-Ethylenediamine Grafted Poly(ethyleneterepthalate) for the Fabrication of Flexible Copper Clad Laminate

Electrochemical Performance of Electroactive Poly(Amic Acid)-Cu2+ Composites

Electroless Plating of Copper on Fluorinated Polyimide Films Modified by Plasma Graft Copolymerization and UV‐induced Graft Copolymerization with 4‐Vinylpyridine

Fabrication of metallic patterns on ordinary polymer substrates by laser direct activation and electroless plating

Exploiting the Combination of Displacement and Chemical Plating for a Tailored Electroless Deposition of Palladium Films on Copper

Mechanistic Study of Ag/Pd-PVP Nanoparticles and Their Functions As Catalyst for Electroless Copper Deposition

Preparation of polymer brush/Ni particle and its application in electroless copper plating on PA12 powder

A New Activation Method For Electroless Metal Plating: Palladium Laden Via Bonding With Self-Assembly Monolayers

Selective‐area electroless copper plating on polyimide employing laser patterning of a catalytic film

Electroless Nickel Metallization on Palladium-free Activated Polyamide Fabric for Electromagnetic Interference Shielding

A facile process to fabricate metal coating on PET sheet: Preparation of highly active polymer brush/Ag particle and its application in electroless copper plating

Chelating Aurum with PP Film Containing PA6 Chains