Unveiling RowPress in Sub-20 nm DRAM Through Comparative Analysis With Row Hammer: From Leakage Mechanisms to Key Features

Longda Zhou,Sheng Ye,Runsheng Wang,Zhigang Ji
DOI: https://doi.org/10.1109/ted.2024.3418300
IF: 3.1
2024-07-26
IEEE Transactions on Electron Devices
Abstract:In this article, we explored the underlying physical mechanisms of RowPress (RP)-induced leakage and its key features in sub-20 nm dynamic random access memory (DRAM). Employing 3-D TCAD simulations, single-sided and double-sided RP were studied and compared with their row hammer (RH) counterparts, focusing on the mechanisms of electron migration (EM) and capacitive crosstalk (CC). The results reveal that RP-induced leakage is not primarily driven by e-trap-assisted EM and CC mechanisms, which are the primary causes of the RH effect. Instead, it is the increased electrical field that facilitates EM, acting as the main contributor to the RP effect. Furthermore, the bit-flip directionality, temperature dependence, access pattern dependence, and data pattern dependence of RP were studied and differences from RH were emphasized, with the underlying mechanisms being thoroughly examined. The scalability of the RP effect is also evaluated. The findings provide a solid theoretical foundation for developing effective mitigation techniques and for the design of DRAM chips with enhanced reliability and security.
engineering, electrical & electronic,physics, applied
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