Abstract:Thermal management is one of the main challenges for the future of electronics<a href="#ref-CR1">1</a>,<a href="#ref-CR2">2</a>,<a href="#ref-CR3">3</a>,<a href="#ref-CR4">4</a>,<a href="/articles/s41586-020-2666-1#ref-CR5">5</a>. With the ever-increasing rate of data generation and communication, as well as the constant push to reduce the size and costs of industrial converter systems, the power density of electronics has risen<a href="/articles/s41586-020-2666-1#ref-CR6">6</a>. Consequently, cooling, with its enormous energy and water consumption, has an increasingly large environmental impact<a href="/articles/s41586-020-2666-1#ref-CR7">7</a>,<a href="/articles/s41586-020-2666-1#ref-CR8">8</a>, and new technologies are needed to extract the heat in a more sustainable way—that is, requiring less water and energy<a href="/articles/s41586-020-2666-1#ref-CR9">9</a>. Embedding liquid cooling directly inside the chip is a promising approach for more efficient thermal management<a href="/articles/s41586-020-2666-1#ref-CR5">5</a>,<a href="/articles/s41586-020-2666-1#ref-CR10">10</a>,<a href="/articles/s41586-020-2666-1#ref-CR11">11</a>. However, even in state-of-the-art approaches, the electronics and cooling are treated separately, leaving the full energy-saving potential of embedded cooling untapped. Here we show that by co-designing microfluidics and electronics within the same semiconductor substrate we can produce a monolithically integrated manifold microchannel cooling structure with efficiency beyond what is currently available. Our results show that heat fluxes exceeding 1.7 kilowatts per square centimetre can be extracted using only 0.57 watts per square centimetre of pumping power. We observed an unprecedented coefficient of performance (exceeding 10,000) for single-phase water-cooling of heat fluxes exceeding 1 kilowatt per square centimetre, corresponding to a 50-fold increase compared to straight microchannels, as well as a very high average Nusselt number of 16. The proposed cooling technology should enable further miniaturization of electronics, potentially extending Moore's law and greatly reducing the energy consumption in cooling of electronics. Furthermore, by removing the need for large external heat sinks, this approach should enable the realization of very compact power converters integrated on a single chip.

High-efficiency cooling via the monolithic integration of copper on electronic devices

Co-designing electronics with microfluidics for more sustainable cooling

Thermal management of chips by a device prototype using synergistic effects of 3-D heat-conductive network and electrocaloric refrigeration

Nature loofah network‐inspired rapid thermal‐conductive and thermochromic‐based nanocomposites for efficient heat management in advanced electronic devices

Electrically driven chip cooling device using hybrid coolants of liquid metal and aqueous solution

A High Efficient Integrated Heat Dissipation Systems with CNT Array Based Heat Lines and Microchannel Heat Sink in 3D ICs

Thermal energy management using supersonically sprayed copper pyramids decorated with zinc oxide nanowires for surface cooling

Low Thermal Expansion Metal Composite-Based Heat Spreader for High Temperature Thermal Management

An efficient cooling solution with 3D interconnected graphene architectures for passive heat dissipation

0D/2D Co-Doping Network Enhancing Thermal Conductivity of Radiative Cooling Film for Electronic Device Thermal Management

Design of Practical Liquid Metal Cooling Device for Heat Dissipation of High Performance Cpus

Two-Electrode Growth and Optimization of Copper Nanocone Structures for Immersion Phase-Change Liquid Cooling

Liquid metal-based flexible and wearable thermoelectric cooling structure and cooling performance optimization

Convective Cooling of Compact Electronic Devices Via Liquid Metals with Low Melting Points

Enhancement of Natural Convection by Carbon Nanotube Films Covered Microchannel-Surface for Passive Electronic Cooling Devices.

Optimizing performance for cooling electronic components using innovative heterogeneous materials

A Novel VLSI Technology to Manufacture High-Density Thermoelectric Cooling Devices

Mechanochemistry-mediated colloidal liquid metals for electronic device cooling at kilowatt levels

Hierarchically Porous Metal-organic Framework Composite for Heat Dissipation of Electronic Devices

Enhanced Heat Dissipation in Graphite-Silver-polyimide Structure for Electronic Cooling

Molybdenum copper based ultrathin two-phase heat transport system for high power-density gallium nitride chips