Detectable Adhesives: Nondestructive Detection of Adhesion
Ziyang Liu,Yue Wang,Ming Wu,Shuangbo Yin,Qingning Li,Qiang Cao,Sijie Zheng,Weizheng Li,Xiaoliang Wang,Feng Yan
DOI: https://doi.org/10.1002/adfm.202413799
IF: 19
2024-09-03
Advanced Functional Materials
Abstract:A nondestructive method is proposed that utilizes electrical signals to real‐time monitor the adhesion state of metal adherents. This method relies on poly(ionic liquid)‐based detectable adhesives to establish the relationship between the electrical signal and adhesion state. It enables in situ monitoring of the adhesive curing process, prediction of adhesion strength, and early detection of adhesion failure through the recording of capacitance and resistance. Metal‐to‐metal adhesives are vital across diverse sectors including automotive, aerospace, and industrial assembly. However, traditional adhesion detection methods are mainly based on the fracture mechanism, posing challenges for nondestructive detection. Here, a nondestructive method that leverages electrical signals to monitor the adhesion state of metal interfaces in real‐time is presented. The approach utilizes detectable adhesives (DA) synthesized from poly(ionic liquid) (PIL), which not only exhibit robust adhesion properties (4.9 MPa) but also function as ionic conductors. By correlating changes in capacitance and resistance with the adhesive state, the method allows for in situ monitoring of the curing process, prediction of adhesion strength, and early detection of potential failures. This dual‐sensing capability, combining electrical and mechanical aspects, enhances understanding of adhesive behavior in diverse conditions, presenting a fresh approach for digitally transforming adhesive technologies.
materials science, multidisciplinary,chemistry, physical,physics, applied, condensed matter,nanoscience & nanotechnology