Molecular dynamics simulation of weak bonds in carbon fiber reinforced plastic adhesive joints

Reimon Terazawa,Atsushi Tamura,Kensuke Kageyama,Takenobu Sakai
DOI: https://doi.org/10.1080/09243046.2021.1893887
IF: 2.92
2021-03-17
Advanced Composite Materials
Abstract:In carbon fiber-reinforced plastic (CFRP) adhesive joints, poor adhesion because of weak bonds may occur due to contamination at the bond line. We reproduced weak bonds by using a molecular dynamics simulation (MD) approach to investigate the mechanisms of weak bonds. Weak-bond models were created by inserting water (H<sub>2</sub>O), xylene (C<sub>8</sub>H<sub>10</sub>), and silicone molecules as contaminants in the two epoxy models. Tensile analysis was performed to evaluate the mechanical properties of the weak-bond models. The results revealed that the insertion of contaminants reduced the strength of these models. Stress concentration occurred due to the concentration of inserted molecules at the bond line. In addition, the yielding behavior was slower in the H<sub>2</sub>O model than in the C<sub>8</sub>H<sub>10</sub> and silicone models, and the strength of the H<sub>2</sub>O model decreased significantly even at a small insertion rate compared with the C<sub>8</sub>H<sub>10</sub> and silicone models. The reason for the difference in yielding behavior may be due to the high diffusion of H<sub>2</sub>O molecules into the whole epoxy resin. The weak-bond model was reproduced using MD, and the mechanisms of weak bonds were clarified by an analysis of van der Waals potential energy.
materials science, composites
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