Abstract:X-ray photoelectron spectroscopy (XPS) has been utilized as a versatile method for thickness characterization of various two-dimensional (2D) films. Accurate thickness can be measured simultaneously while acquiring XPS data for chemical characterization of 2D films having thickness up to approximately 10 nm. For validating the developed technique, thicknesses of few-layer graphene (FLG), MoS2 and amorphous boron nitride (a-BN) layer, produced by microwave plasma chemical vapor deposition (MPCVD), plasma enhanced chemical vapor deposition (PECVD), and pulsed laser deposition (PLD) respectively, were accurately measured. The intensity ratio between photoemission peaks recorded for the films (C 1s, Mo 3d, B 1s) and the substrates (Cu 2p, Al 2p, Si 2p) is the primary input parameter for thickness calculation, in addition to the atomic densities of the substrate and the film, and the corresponding electron attenuation length (EAL). The XPS data was used with a proposed model for thickness calculations, which was verified by cross-sectional transmission electron microscope (TEM) measurement of thickness for all the films. The XPS method determines thickness values averaged over an analysis area which is orders of magnitude larger than the typical area in cross-sectional TEM imaging, hence provides an advanced approach for thickness measurement over large areas of 2D materials. The study confirms that the versatile XPS method allows rapid and reliable assessment of the 2D material thickness and this method can facilitate in tailoring growth conditions for producing very thin 2D materials effectively over a large area. Furthermore, the XPS measurement for a typical 2D material is non-destructive and does not require special sample preparation. Therefore, after XPS analysis, exactly the same sample can undergo further processing or utilization.

Non-destructive depth profile evaluation of multi-layer thin film stack using simultaneous analysis of data from multiple X-ray photoelectron spectroscopy instruments

XPS for non-destructive depth profiling and 3D imaging of surface nanostructures

Towards nanometric resolution in multilayer depth profiling: a comparative study of RBS, SIMS, XPS and GDOES

Sub‐Nanometer Depth Profiling of Native Metal Oxide Layers Within Single Fixed‐Angle X‐Ray Photoelectron Spectra

Direct structure depth profiling of polycrystalline thin films by X-ray diffraction and its application

XPS depth profiling of nano-layers by a novel trial-and-error evaluation procedure

Simultaneous Measurement of Local Longitudinal and Transverse Wave Velocities, Attenuation, Density, and Thickness of Films by Using Point-Focus Ultrasonic Spectroscopy

Versatile technique for assessing thickness of 2D layered materials by XPS

Combination of High‐resolution RBS and Angle‐resolved XPS: Accurate Depth Profiling of Chemical States

Nondestructive evaluation of thermal-process-induced change of Sn/Cu/Ni plating thin film stacks based on EDX measurement and Bayesian inference

Depth Profiling Of Nanometer Thin Layers By Laser Desorption And Laser Postionization Time-Of-Flight Mass Spectrometry

Reference-free evaluation of thin films mass thickness and composition through energy dispersive X-ray spectroscopy

Reverse depth profiling of electrodeposited Co/Cu multilayers by SNMS

Accurate high-resolution depth profiling of magnetron sputtered transition metal alloy films containing light species: A multi-method approach

Time‐of‐flight secondary ion mass spectrometry and X‐ray photoelectron spectroscopy protocol for the analysis of organic multilayers

In-situ and Elementally Resolved Determination of the Thickness Uniformity of Multi-Ply Films by Confocal Micro XRF.

Development of Simultaneous Measurement System for X-ray Absorption Spectra at Two Absorption Edges

Novel Method of Measuring the Thickness of Nanoscale Films Using Energy Dispersive X‐Ray Spectroscopy Line Scan Profiles

Depth dependent local structures in thin films unraveled by grazing incidence x-ray absorption spectroscopy

Depth Profiling of Nanometer Coatings by Low Temperature Plasma Probe Combined with Inductively Coupled Plasma Mass Spectrometry.

Femtosecond laser ablation (fs-LA) XPS – A novel XPS depth profiling technique for thin films, coatings and multi-layered structures