Studies of Splat Formation of Copper and Copper Aluminium on Ceramic Substrate in Plasma Spray Process

A. T. T. Tran,M. M. Hyland,M. Fukumoto,P. Munroe
DOI: https://doi.org/10.1007/s11666-015-0294-3
IF: 2.839
2015-09-03
Journal of Thermal Spray Technology
Abstract:Of the substrate-related factors that will influence splat formation, alloying elements has been little studied. In the present work, we have examined the role of alloying elements in controlling the extent of splashing of plasma-sprayed splats. Splats of copper (Cu) and copper alloyed with Al and Zr were deposited by plasma spray or as free-falling droplets. The splat formation and splat-substrate interfaces were characterized using SEM and FIB. It was found that the presence of aluminium in plasma-sprayed Cu-10%Al increased the portion of favorable disk-shaped splats compared to pure copper. It was also found that the disk-shaped splat proportion of Cu-10%Al at room temperature is nearly identical to that of Cu splat at 300 °C, indicating that the addition of Al in the alloy leads to the improvement of splat formation, correlating with the improvement in the interface bonding with the substrate.
materials science, coatings & films
What problem does this paper attempt to address?