The chips are down for Moore’s law

M. Mitchell Waldrop

DOI: https://doi.org/10.1038/530144a

IF: 64.8

2016-02-01

Nature

Abstract:The semiconductor industry will soon abandon its pursuit of Moore's law. Now things could get a lot more interesting.

multidisciplinary sciences

What problem does this paper attempt to address?

Moore's Law is dead, long live Moore's Law!

Nick Zhang

2022-05-27

Abstract:Moore's Law has been used by semiconductor industry as predicative indicators of the industry and it has become a self-fulfilling prophecy. Now more people tend to agree that the original Moore's Law started to falter. This paper proposes a possible quantitative modification to Moore's Law. It can cover other derivative laws of Moore's Law as well. It intends to more accurately predict the roadmap of chip's performance and energy consumption.

General Literature
Moore's Law: The potential, limits, and breakthroughs

Fulai Zhu,Jiahao Zong,Peiyu Xu

DOI: https://doi.org/10.54254/2755-2721/10/20230038

2023-09-25

Abstract:Moore's Law is a concept that notes the doubling of the number of transistors on a microchip around every two years, resulting in exponential advancement in computing power and diminishing costs. However, as transistor sizes have approached the physical limits of silicon-based technology, maintaining this pace of growth has become increasingly challenging. As a result, researchers have been exploring alternative solutions, such as System-in-package(SiP), Chiplets, Non-volatile memory, Biocomputing, quantum computing, and photonics. While these technologies are still in the early stages of development, they offer promising solutions to the challenges facing the continued growth of computing power. As we continue to explore new avenues for technological advancement, we may find that Moore's Law continues to hold true in unexpected and exciting ways.

Physics,Computer Science,Engineering
Nanoelectronics: Materials, Devices and Applications

Chunchang Wang

DOI: https://doi.org/10.3390/nano14211716

2024-01-01

Abstract:The semiconductor industry is facing concerns regarding the saturation of Moore’s Law [...]
A Discussion on the Extension of Moore's Law

TF Li,ZJ Li

DOI: https://doi.org/10.1109/icsict.2004.1434998

2004-01-01

Abstract:Both theory and ITRS predict that the scaling of conventional silicon CMOS is going to approach its ultimate. Several emerging devices based on different new mechanism are proposed as possible successors. But still, as classical 2-level switches, they have common limits of quantum uncertainty and thermodynamic fluctuation. In order to further enhance and improve the ability and performance of ULSI systems, either more efficient devices or processing systems with new model and architecture are required. In this article, these topics are briefly discussed in unified view of the product of device delay time and its power dissipation.
Prolegomena To Any Future Device Physics

Adam L. Friedman,Aubrey T. Hanbicki

DOI: https://doi.org/10.48550/arXiv.2110.15822

2021-10-29

Abstract:For the last 60 years, advances in conventional computing platforms have been driven by the empirical notion known as Moores law. In its essence, Moores law is a ubiquitous description of the exponential increase in transistor density acting as a proxy for computing power as a function of time. While this trend started as an interesting observation, it has evolved into a self-fulfilling prophecy used to drive the entire semiconductor industry. Arguments for or against the end of Moores law have proliferated and the reluctant consensus is that Moores law will disappear. Warnings of the end of this trend have been repeatedly thwarted by advances in many different aspects of the computing ecosystem including materials improvements, device design, device or circuit cleverness, and software and architectural innovations. While many have argued the impending doom of Moores law is the ultimate roadblock imposed by atomic length scales, quantum processes, and energy consumption limits, we contend that Moores law must be jettisoned for a different reason: Words matter. Even those who adamantly declare the end of Moores law still use the language of Moores law. The inward focus of this notion imposes an intellectual tyranny that inhibits revolutionary progress. We suggest instead a more outwardly focused perspective and suggest a shift in language to a regime we coin the Feynman Mandate. In this perspective, we outline the issues with the continued use of Moores law as well as a prescription of transitioning to a new lexicon. We outline a new, more general metric for ascertaining progress and identify the roles of various stakeholders in this process.

Physics and Society,Materials Science,History and Philosophy of Physics,Popular Physics
Moore's law: new playground for quantum physics

M. Van Rossum,W. Schoenmaker,W. Magnus,K. De Meyer,M. D. Croitoru,V. N. Gladilin,V. M. Fomin,J. T. Devreese

DOI: https://doi.org/10.1002/pssb.200301788

2003-05-01

physica status solidi (b)

Abstract:CMOS technology has been proven as one of the most important achievements in modern engineering history. In less than 30 years, it has become the primary engine driving the world economy. Device scaling makes this possible. For decades, progress in device scaling has followed an exponential curve: this has come to be known as Moore's law. Downscaling such devices like MOSFETs to their limiting sizes is a key challenge of the semiconductor industry now. Therefore device simulation requires new theory and modeling techniques, what helps to improve the understanding of device physics and design, for structures at the sub‐100 nm scale, and complements experimental work in addressing this challenge. We present a new approach, which allows us to make predictions about performance of future MOSFETs. The quantum‐mechanical features of the electron transport are extracted from the numerical solution of the quantum Liouville equation in the Wigner function representation.

physics, condensed matter
Moore's Law in CLEAR Light

Shuai Sun,Vikram K. Narayana,Tarek El-Ghazawi,Volker J. Sorger

DOI: https://doi.org/10.48550/arXiv.1612.02898

2016-12-09

Abstract:The inability of Moore's Law and other figure-of-merits (FOMs) to accurately explain the technology development of the semiconductor industry demands a holistic merit to guide the industry. Here we introduce a FOM termed CLEAR that accurately postdicts technology developments since the 1940's until today, and predicts photonics as a logical extension to keep-up the pace of information-handling machines. We show that CLEAR (Capability-to-Latency-Energy-Amount-Resistance) is multi-hierarchical applying to the device, interconnect, and system level. Being a holistic FOM, we show that empirical trends such as Moore's Law and the Makimoto's wave are special cases of the universal CLEAR merit. Looking ahead, photonic board- and chip-level technologies are able to continue the observed doubling rate of the CLEAR value every 12 months, while electronic technologies are unable to keep pace.

Emerging Technologies
5 Questions for Julien Ryckaert: Why CMOS 2.0 is the Next Phase of Moore's Law

Samuel K. Moore

DOI: https://doi.org/10.1109/mspec.2024.10458093

IF: 3.578

2024-03-06

IEEE Spectrum

Abstract:CMOS, the silicon logic technology behind decades and decades of smaller transistors and faster computers, is entering a new phase. CMOS uses two types of transistors in pairs to limit a circuit's power consumption. In this new phase, "CMOS 2.0," that part's not going to change, but how processors and other complex CMOS chips are made will. Julien Ryckaert, vice president of logic technologies at Imec, the Belgium-based nanotechnology research center, told IEEE Spectrum where things are headed.

engineering, electrical & electronic
The Moore's Law Machine: The Next Trick to Tinier Transistors is High-Numerical-Aperture EUV Lithography

Jan Van Schoot

DOI: https://doi.org/10.1109/mspec.2023.10234175

IF: 3.578

2023-09-01

IEEE Spectrum

Abstract:Over the last half-century, we've come to think of Moore's Law—the roughly biennial doubling of the number of transistors in a given area of silicon, the gains that drive computing forward—as something that just happens, as though it were a natural, inevitable process, akin to evolution or aging. The reality, of course, is much different. Keeping pace with Moore's Law requires almost unimaginable expenditures of time, energy, and human ingenuity—thousands of people on multiple continents and endless acres of some of the most complex machinery on the planet. • Perhaps the most essential of these machines performs extreme-ultraviolet (EUV) photolithography. EUV lithography, the product of decades of R&D, is now the driving technology behind the past two generations of cutting-edge chips, used in every top-end smartphone, tablet, laptop, and server in the last three years. Yet Moore's Law must march on, and chipmakers continue to advance their road maps, meaning they'll need to shrink device geometries even further. • So at ASML, my colleagues and I are developing the next generation of lithography. Called high-numerical-aperture EUV lithography, it involves a major overhaul of the system's internal optics. High-NA EUV should be ready for commercial use in 2025, and chipmakers are depending on its capabilities to keep their promised advances through the end of this decade.

engineering, electrical & electronic
Review of Advanced CMOS Technology for Post-Moore Era

Ming Li

DOI: https://doi.org/10.1007/s11433-012-4930-3

2012-01-01

Science China Physics Mechanics and Astronomy

Abstract:The continuous downsizing of device has sustained Moore’s law in the past 40 years. As the power dissipation becomes more and more serious, a lot of emerging technologies have been adopted in the past decade to solve the short channel effect, leakage and performance degradation problems. In this paper, the emerging scaling technologies and device innovations, including high-k/metal gate, strain, ultra-shallow junction, tri-gate FinFET, extremely thin SOI and silicon nanowire FET will be reviewed and discussed in terms of the potential and challenge for post-Moore era.
Is 3D chip technology the next growth engine for performance improvement?

Philip Emma,Eren Kurshan

2024-09-06

Abstract:The semiconductor industry is reaching a fascinating confluence in several evolutionary trends that will likely lead to a number of revolutionary changes in how computer systems are designed, implemented, scaled, and used. Since Moores Law, which has driven the evolution in systems for the last several decades, is imminently approaching real and severe limitations, the ability to create three-dimensional,3D, device stacks appears promising as a way to continue to integrate more devices into a chip.While on the one hand, this nascent ability to make 3D technology can be interpreted as merely an extension of Moores Law, on the other hand, the fact that systems can now be integrated across multiple planes poses some novel opportunities, as well as serious challenges and questions. In this paper, we explore these various challenges and opportunities and discuss structures and systems that are likely to be facilitated by 3D technology. We also describe the ways in which these systems are likely to change. Since 3D technology offers some different value propositions, we expect that some of the most important ways in which 3D technology will likely impact our approach to future systems design, implementation, and usage are not yet obvious to most system designers, and we outline several of them.

Emerging Technologies
Carbon based electronic technology in post-Moore era: progress, applications and challenges

Yi-Fan Liu,Zhi-Yong Zhang,

DOI: https://doi.org/10.7498/aps.71.20212076

IF: 0.906

2022-01-01

Acta Physica Sinica

Abstract:In the past 60 years, silicon-based semiconductor technology has triggered off the profound change of our information society, but it is also gradually approaching to the physical limit and engineering limit as well. Thus, the global semiconductor industry has entered into the post-Moore era. Carbon nanotube has many excellent electronic properties such as high mobility and ultra-thin body, so it has become a hopeful candidate for the new semiconductor material in the post-Moore era. After more than 20 years of development, carbon based electronic technology has made fundamental breakthroughs in many basic problems such as material preparation, Ohmic metal-semiconductor contact and gate engineering. In principle, there is no insurmountable obstacle in its industrialization process now. Therefore, in this paper the intrinsic advantages of carbon based electronic technology in the post-Moore era is introduced, the basic problems, progress and optimization direction of carbon based electronic technology are summarized, the application prospects in the fields of digital circuits, radio frequency electronics, sensing and detection, three-dimensional integration and chips for special applications are presented. Finally, the comprehensive challenges to the industrialization of carbon based electronic technology are analyzed, and its future development is also prospected.

physics, multidisciplinary
Skyrmion-Electronics: An Overview and Outlook.

Wang Kang,Yangqi Huang,Xichao Zhang,Yan Zhou,Weisheng Zhao

DOI: https://doi.org/10.1109/JPROC.2016.2591578

IF: 20.6

2016-01-01

Proceedings of the IEEE

Abstract:The well-known empirical phenomenon known as Moore's Law has held true for the past half century. However, it is beginning to break down, owing to limitations arising from leakage currents caused by the quantum effect. As a result, the search for alternatives or complementary technologies that can aid the downscaling of complementary metal-oxide-semiconductor (CMOS) technology has been accelerated...
The Era of GAAFET Is About to Come

Tianyi Xu

DOI: https://doi.org/10.61173/gnrwmp22

2024-02-19

Abstract:In recent years, with the development of the semiconductor industry, Moore’s Law has gradually become ineff ective, making it increasingly diffi cult for people to improve chip manufacturing processes. Many people believe that Moore’s Law will no longer exist. However, with Samsung announcing the production of 3-nanometer gate-all-around (GAA) architecture process technology chips on June 30, 2022, the chip process has been further advanced. Moore’s Law is expected to continue in the coming years. This article will mainly introduce why GAAFET will become the mainstream fi eld-eff ect transistor in the future. The potential problems that GAAFET may encounter in its future development will also be analyzed, including massive research and development costs and a longer research and development cycle.
State of the Art and Future Perspectives in Advanced CMOS Technology

Henry H. Radamson,Huilong Zhu,Zhenhua Wu,Xiaobin He,Hongxiao Lin,Jinbiao Liu,Jinjuan Xiang,Zhenzhen Kong,Wenjuan Xiong,Junjie Li,Hushan Cui,Jianfeng Gao,Hong Yang,Yong Du,Buqing Xu,Ben Li,Xuewei Zhao,Jiahan Yu,Yan Dong,Guilei Wang

DOI: https://doi.org/10.3390/nano10081555

IF: 5.3

2020-08-07

Nanomaterials

Abstract:The international technology roadmap of semiconductors (ITRS) is approaching the historical end point and we observe that the semiconductor industry is driving complementary metal oxide semiconductor (CMOS) further towards unknown zones. Today’s transistors with 3D structure and integrated advanced strain engineering differ radically from the original planar 2D ones due to the scaling down of the gate and source/drain regions according to Moore’s law. This article presents a review of new architectures, simulation methods, and process technology for nano-scale transistors on the approach to the end of ITRS technology. The discussions cover innovative methods, challenges and difficulties in device processing, as well as new metrology techniques that may appear in the near future.

materials science, multidisciplinary,physics, applied,nanoscience & nanotechnology,chemistry
The Road to Chirality-Specific Growth of Single-Walled Carbon Nanotubes

Shuchen Zhang,Lianming Tong,Jin Zhang

DOI: https://doi.org/10.1093/nsr/nwx080

IF: 20.6

2017-01-01

National Science Review

Abstract:Moore’s law has been declared to be eventually nearing its end after nearly five decades,with silicon being the main building block for all computing chips[1].The main roadblock in the development of transistors is the occurrence of the tunneling effect when the devices become small enough.A possible solution is finding alternative materials to fabricate a‘millivolt switch’,which is at least as fast as silicon counterparts and generates much less heat.
Cambrian explosion of computing and big data in the post-moore era

Satoshi Matsuoka

DOI: https://doi.org/10.1145/3208040.3225055

2018-06-11

Abstract:The so-called "Moore's Law", by which the performance of the processors will increase exponentially by factor of 4 every 3 years or so, is slated to be ending in 10--15 year timeframe due to the lithography of VLSIs reaching its limits around that time, and combined with other physical factors. We are now embarking on a project to revolutionize the total system architectural stack in a holistic fashion in the Post-Moore era, from devices and hardware, abstracted by system software and programming models and languages, and optimized according to the device characteristics with new algorithms and applications that exploit them. Such systems will have multitudes of varieties according to the matching characteristics of applications to the underlying architecture, leading to what can be metaphorically described as Cambrian Explosion of computing systems. The diverse elements of such systems will be interconnected with next-generation terabit optics and networks, allowing metropolitan-scale computing infrastructure that would truly realize high performance parallel and distributed computing. However, which algorithms and applications would benefit the most from such future computing, given that some physical constants, e.g., communication latency, cannot be improved? We speculate on some of the scenarios that would change the nature of current Cloud-centric infrastructures towards the Post-Moore era.
Molecular Electronics: From Physics to Computing

Yongqiang Xue,Mark A. Ratner

DOI: https://doi.org/10.48550/arXiv.cond-mat/0508477

2005-10-03

Abstract:Even if Moore's Law continues to hold, it will take about 250 years to fill the performance gap between present-day computer and the ultimate computer determined from the laws of physics alone. Information processing technology in the post-CMOS era will likely consist of a heterogeneous set of novel device technologies that span a broad range of materials, operational principles, data representations, logic systems and architectures. Molecular nanostructures promise to occupy a prominent role in any attempt to extend charge-based device technology beyond the projected limits of CMOS scaling. We discuss the potentials and challenges of molecular electronics and identify the fundamental knowledge gap that needs to be addressed for a successful introduction of molecule-enabled computing technology

Mesoscale and Nanoscale Physics,Materials Science
Furthering Moore’s Law Integration Benefits in the Chiplet Era

Rob Munoz

DOI: https://doi.org/10.1109/mdat.2023.3302809

2023-01-01

Abstract:Chiplets are die that have been optimized to connect to other die within the same packaged device. Chiplets are increasingly becoming a key vector to deliver Moore’s Law integration benefits. Thanks to broadly available technology and effective industry collaboration, a chiplet approach is becoming mainstream and multivendor interoperable for high volume applications, enabling reuse at industry scale. 3D chiplet packaging/integration is also being adopted in volume, albeit with limited reusability. Potential chiplet benefits include reducing portfolio costs, helping scale innovation and delivery capabilities, and improving time to solution. The industry is addressing the key requirements for broad chiplet adoption and scaling. However, there are trade-offs around tiling overheads, thermal and I/O escape constraints, and associated supply chain and economic considerations that must be managed. By using a chiplet approach effectively, designers can help the industry continue to deliver Moore’s Law integration benefits for many years to come.

engineering, electrical & electronic,computer science, hardware & architecture
More-than-Moore Steep Slope Devices for Higher frequency Switching Applications: A Designer's Perspective

Joy Chowdhury,Angsuman Sarkar,Kamalakanta Mahapatra,J. K. Das

DOI: https://doi.org/10.1088/1402-4896/ad2da2

2024-02-29

Physica Scripta

Abstract:The progress in IC miniaturization dictated by Moore's Law has taken a leap from mere circuit integration to IoT enabled System-on-Chip (SoC) deployments. Such systems are connoted by contemporary advancements in the semiconductor industry roadmaps namely, 'More-Moore' and 'More-than-Moore' (MtM). For meaningful integration of digital and non-digital blocks, a power performance tradeoff is essential for maximum and fruitful utilization of the silicon area. Using the techniques under the MtM nomenclature allows the use of unconventional steep slope devices like Tunneling FETs, Negative Capacitance (NC) FETs, Gate-all-around FETs (GAA) and FinFETs etc., which can exhibit reasonable performance with lower supply voltages. Following the Device Technology Co-optimization (DTCO) and System Technology Co optimization (STCO) the advanced 3D heterogenous integration technologies allow sensors, analog/mixed signal and passive components to be assimilated within the same package as the CMOS blocks. Appropriate device engineering techniques like multi-gate architectures, vertical stacking transistors, compound semiconductors and alternate carrier transport phenomena are required to improve the current drive and scaling performance of advanced CMOS devices. CMOS based codesign is essential to realize new topologies for energy economical computation, sensing and information processing as the beyond CMOS steep slope devices are independently incapable of replacing conventional bulk CMOS devices. This article presents a detailed qualitative review of the various aspects of MtM beyond CMOS steep slope switches and their prospective integration technologies. For system level integration, various aspects of device performance and optimizations, related device-circuit interactions, dielectric technologies at the advance nanometer nodes have been probed into. Additionally, novel circuit topologies, synthesis algorithms and processor level performance evaluation using steep slope switches have been investigated. An exclusive compact overview for contemporary insights into integrated device-system development methodology and its performance evaluation is presented.

physics, multidisciplinary

The chips are down for Moore’s law

Moore's Law is dead, long live Moore's Law!

Moore's Law: The potential, limits, and breakthroughs

Nanoelectronics: Materials, Devices and Applications

A Discussion on the Extension of Moore's Law

Prolegomena To Any Future Device Physics

Moore's law: new playground for quantum physics

Moore's Law in CLEAR Light

5 Questions for Julien Ryckaert: Why CMOS 2.0 is the Next Phase of Moore's Law

The Moore's Law Machine: The Next Trick to Tinier Transistors is High-Numerical-Aperture EUV Lithography

Review of Advanced CMOS Technology for Post-Moore Era

Is 3D chip technology the next growth engine for performance improvement?

Carbon based electronic technology in post-Moore era: progress, applications and challenges

Skyrmion-Electronics: An Overview and Outlook.

The Era of GAAFET Is About to Come

State of the Art and Future Perspectives in Advanced CMOS Technology

The Road to Chirality-Specific Growth of Single-Walled Carbon Nanotubes

Cambrian explosion of computing and big data in the post-moore era

Molecular Electronics: From Physics to Computing

Furthering Moore’s Law Integration Benefits in the Chiplet Era

More-than-Moore Steep Slope Devices for Higher frequency Switching Applications: A Designer's Perspective