Abstract:Low-cycle fatigue (LCF) behavior of nickel-based precipitation-strengthened superalloy GH4145/SQ was investigated systematically under fully reversed total strain amplitude control conditions at 538°C in laboratory air. It was shown that the alloy exhibited a pronounced initial fatigue hardening followed by continuous fatigue softening to failure at high strain amplitudes, while at low strain amplitudes the initial hardening was followed by a well-defined saturation stage. Microstructure observations using optical and transmission-electron microscopy revealed that slip band density increased with increasing total strain amplitudes and the size of the γ′precipitates tended to reduction due to repeated shearing by the dislocations with continuous cyclic straining. The above changes in microstructures during cycling were essentially responsible for the fatigue hardening–softening behavior of the alloy. Both optical and SEM micrographs indicated that at low strain amplitudes crack propagation was basically transgranular, while at high strain amplitudes crack propagation was essentially intergranular. Bilinear behavior with a change of slope at a plastic strain amplitude of about 0.2pct was observed in cyclic stress–strain (CSS), Coffin–Manson (C–M) and plastic strain energy–life plots. A change in the number of operating slip systems and the fracture modes with the strain amplitude employed was used to explain this two-slope characteristic. In both the companion specimens test (CST) and the incremental step test (IST) methods the alloy exhibited non-masing type behavior. It was suggested that, for the first approximation, the half-life plastic strain energy could be calculated directly according to the equation without reckoning in the non-masing behavior.

Influence of Cyclic Strain-Hardening Exponent on Fatigue Ductility Exponent for a Sn-Ag-Cu Micro-Solder Joint

Effect of cyclic straining at elevated-temperature on static mechanical properties, microstructures and fracture behavior of nickel-based superalloy GH4145/SQ

The low-cycle fatigue, deformation and final fracture behaviour of an austenitic stainless steel

An Investigation of the Effect of High-Temperature Cyclic Straining and Creep Loading on Tensile Mechanical Properties of GH4145/SQ Alloy

Low cycle fatigue behavior of nickel-based superalloy GH4145/SQ at elevated temperature

Multi-scale Deformation Behavior Investigation of 18cr–8ni Austenitic Steel Subjected to Low-Cycle Fatigue Loading

Strain Ratio Effects on Low-Cycle Fatigue Behavior and Deformation Microstructure of 2124-T851 Aluminum Alloy

Determination of fatigue mesoscopic mechanical properties of an austenitic stainless steel using depth-sensing indentation (DSI) technique

Investigation of fatigue mechanical properties of apolycrystalline solid at mesoscopic scale using depth-sensing indentation (DSI) technique

Influence of Strain Amplitude on Low-Cycle Fatigue Behaviors of a Fourth-Generation Ni-Based Single-Crystal Superalloy at 980 °C

Prediction of Variability in Vibration Durability of Oligocrystalline SnAgCu Solder Joints

Lifetime prediction and fracture behavior of shear cycled Cu/Sn–3.0Ag–0.5Cu/Cu joints under current stressing

The Impact of Cooling Rate on the Tensile and Cyclic Stress-Strain Characteristics of Different Solder Alloys at Nanoscale

ISOTHERMAL SHEAR LOW-CYCLE FATIGUE BEHAVIOUR OF 62Sn-36Pb-2ag SURFACE MOUNT SOLDER JOINTS

Fatigue Life Analysis of Solder Joints in Flip Chip Bonding

Solder Joint Geometry Effects on Thermomechanical Fatigue Lifetime of End-Capped Chip Component Assemblies

Fatigue Crack Growth Behavior of Small Sn-Bi-Ag Solder Joints

Estimation of the Thermal-Mechanical Fatigue Behavior of Sn/Pb Solder Joints

Effect of Loading Type on Fatigue Crack Growth Behavior of Solder Joint in Electronic Packaging

Shear and Fatigue Properties of Lead-Free Solder Joints: Modeling and Microstructure Analysis

Aging Interfacial Structure and Abnormal Tensile Strength of SnAg3Cu0.5/Cu Solder Joints