A two-phase three-field modeling framework for heat pipe application in nuclear reactors

Shanbin Shi,Yang Liu,Ilyas Yilgor,Piyush Sabharwall
DOI: https://doi.org/10.1016/j.anucene.2021.108770
IF: 1.9
2022-01-01
Annals of Nuclear Energy
Abstract:Heat pipes and two-phase thermosyphons are highly efficient heat transfer devices utilizing continuous evaporation and condensation of working fluid for two-phase heat transport in closed systems. Because of the nearly isothermal and fully passive phase-change heat transfer mechanism, heat pipes and thermosyphons have found many applications in nuclear engineering, space technologies, and other energy systems. High-temperature heat pipes are used in nuclear microreactors to remove fission power from the primary system and are coupled with power conversion systems or process heat applications. Modeling of the two-phase flow phenomena inside a heat pipe is essential to its design and safety analysis. In this study, a comprehensive one-dimensional two-phase three-field flow model has been developed for the analysis of heat pipes in normal operation conditions and transients. The conservation or field equations of mass, momentum, and energy were developed for the liquid film, vapor, and droplet. In addition, constitutive models or correlations were reviewed thoroughly and provided for the closure of the three-field equations. Specific constitutive equations regarding interfacial mass and heat transfer at two interfaces, namely film-gas interface and gas-droplet interface, were reviewed for droplet entrainment and deposition rates as well as film and droplet evaporation rates. Additionally, mechanistic correlations of annular flow film thickness were recommended for the modeling of the thermosyphons without a wick as a critical constitutive correlation. Furthermore, experimental data needs from new experiments using a prototype working fluid or surrogate fluids for the model validation of high-temperature heat pipes in microreactors were recommended for future research.
nuclear science & technology
What problem does this paper attempt to address?