Solidification Structure Evolution and Grain Refinement Mechanism of a Deeply Undercooled Ni65Cu35 Alloy

Xiaolong Xu,Yukang An,Hua Hou,Yuhong Zhao
DOI: https://doi.org/10.1007/s12540-021-01075-7
IF: 3.451
2021-10-29
Metals and Materials International
Abstract:The maximum 320 K undercooling of Ni65Cu35 alloy was obtained by means of cyclic superheating in the state of molten glass. The solidification structuresat different undercoolings were systematically studied. There are two grain refinementsat low and high undercoolings. It was generally believed that the grain refinement atlowundercooling was caused by dendrite superheat remelting. Electron backscattering diffraction was used to characterize the solidification structure athighundercooling, and obvious random orientation, high-angle grain boundaries and twin boundaries were found, indicating grain refinement was caused by recrystallization under highundercooling. There were almost no visible dislocation defects in the TEM bright-field images at high undercooling, and the microstructure hardness decreased obviously after grain refinement. This further illustrated the rapid accumulation of stress and defects in recalescenceare completely abreacted in recrystallization during post-recalescence period, at the same time as the driving force to promote the second grain refinement in the microstructure.Graphic Abstract
materials science, multidisciplinary,metallurgy & metallurgical engineering
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