Development of eco-friendly wall insulation layer utilising the wastes of the packing industry
Abdul Kareem K Alsaffar,Saif S Alquzweeni,Lubna R Al-Ameer,Abduljabar H Ali,Ahmed Mohamed,Humoud M Aldaihani,A Reham,Nadhir Al-Ansari,Osamah Al-Hashimi,Ali Shubbar,Mohammad Amir Khan,Khalid Hashim
DOI: https://doi.org/10.1016/j.heliyon.2023.e21799
IF: 3.776
2023-10-31
Heliyon
Abstract:Efficient thermal insulation materials considerably lower power consumption for heating and cooling of buildings, which in turn minimises CO2 emissions and improves indoor comfort conditions. However, the selection of suitable insulation materials is governed by several factors, such as the environmental impact, health impact, cost and durability. Additionally, the disposal of used insulation materials is a major factor that affects the selection of materials because some materials could be very toxic for humans and the environment, such as asbestos-containing materials. Therefore, there is a continuous research effort, in both industry and academia, to develop sustainable and affordable insulation materials. In this context, this work aims at utilising the packing industry wastes (cardboard) to develop an eco-friendly insulation layer, which is a biodegradable material that can be disposed of safely after use. Experimentally, wasted cardboard was collected, cleaned, and soaked in water for 24 h. Then, the wet cardboard was minced and converted into past papers, then cast in square moulds and left in a ventilated oven at 75 °C to dry before de-moulding them. The produced layers were subjected to a wide range of tests, including thermal conductivity, acoustic insulation, infrared imaging and bending resistance. The obtained results showed the developed material has a good thermal and acoustic insulation performance. Thermally, the developed material had the lowest thermal conductivity (λ) (0.039 W/m.K) compared to the studied traditional materials. Additionally, it successfully decreased the noise level from 80 to about 58 dB, which was better than the efficiency of the commercial polyisocyanurate layer. However, the bending strength of the developed material was a major drawback because the material did not resist more than 0.6 MPa compared to 2.0 MPa for the commercial polyisocyanurate and 70.0 MPa for the wood boards. Therefore, it is recommended to investigate the possibility of strengthening the new material by adding fibres or cementitious materials.