Cure Kinetics and Thermal Properties of Octa(aminophenyl)-POSS/Bromobisphenol A Epoxy Resin Nanocomposites

Jungang Gao,Xuefang Zhang,Hongqiu Lv
DOI: https://doi.org/10.1080/00914037.2011.617331
2012-12-01
International Journal of Polymeric Materials
Abstract:The tetrabromobisphenol A epoxy resin (TBBPAER) was synthesized and Octa(aminophenyl) polyhedral oligomeric silsesquioxane (OAP-POSS) was used as a curing reagent of TBBPAER. The cure kinetics, the glass transition temperature, and the flame resistance of OAP-POSS/TBBPAER nanocomposites were investigated. The results show that the curing reaction could be described by the autocatalytic Šesták-Berggren (S-B) model. The average activation energy E a is 129.59 KJ/mol, the maximal mechanical loss temperature (T p) is 166°C, when the molar ratio (N s) of amino group to epoxy group is 0.5. The oxygen index for fire resistance is 46 ∼ 49 for different amounts of OAP-POSS.
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