A Compact Model of Metal–Ferroelectric-Insulator–Semiconductor Tunnel Junction

Chien-Ting Tung,Girish Pahwa,Sayeef Salahuddin,Chenming Hu
DOI: https://doi.org/10.1109/ted.2021.3130857
IF: 3.1
2022-01-01
IEEE Transactions on Electron Devices
Abstract:In this article, we present a compact model of metal–ferroelectric (FE)–insulator–semiconductor (MFIS) tunnel junction. Unlike the metal–FE–metal (MFM) structure with only one insulator layer, MFIS–FE tunnel junction (FTJ) contains two insulator layers and a semiconductor electrode. The complex structure makes it difficult to self-consistently solve the Poisson and charge equations. We report the first compact model of MFIS-FTJ to our knowledge. Previous modeling studies focused on numerical simulation, which is time-consuming and not applicable to circuit simulation. The presented compact model is suitable for commercial SPICE IC simulation. It includes a FE model that can capture polarization switching under arbitrary applied voltage, an insulator–semiconductor model that calculates the potential profile of the MFIS stack, and an analytical tunneling current model. We demonstrate that this model can be used to simulate and fit both n-type and p-type MFIS-FTJs.
engineering, electrical & electronic,physics, applied
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