Abstract:Atomic oxygen (AO) is the most abundant element in the low Earth orbit (LEO). It is the result of the dissociation of molecular oxygen by ultraviolet radiation from the sun. In the LEO, it collides with the materials used on spacecraft surfaces and causes degradation of these materials. The degradation of the materials on the surface of spacecrafts at LEO has been a significant problem for a long time. Kapton polyimide, polyhedral oligomeric silsesquioxane (POSS), silica, and Teflon are the materials extensively used in spacecraft industry, and like many other materials used in spacecraft industry, AO collision degradation is an important issue in their applications on spacecrafts. To investigate the surface chemistry of these materials in exposure to space AO, a computational chemical evaluation of the Kapton polyimide, POSS, amorphous silica, and Teflon was performed in separate simulations under similar conditions. For performing these simulations, the ReaxFF reactive force-field program was used, which provides the computational speed required to perform molecular dynamics (MD) simulations on system sizes sufficiently large to describe the full chemistry of the reactions. Using these simulations, the effects of AO impact on different materials and the role of impact energies, the content of material, and temperature of material on the behavior of the materials are studied. The ReaxFF results indicate that Kapton is less resistant than Teflon toward AO damage. These results are in good agreement with experiment. These simulations indicate that the amorphous silica shows the highest stability among these materials before the start of the highly exothermic silicon oxidation. We have verified that adding silicon to the bulk of the Kapton structure enhances the stability of the Kapton against AO impact. Our canonical MD simulations demonstrate that an increase in the heat transfer in materials during AO impact can provide a considerable decrease in the disintegration of the material. This effect is especially relevant in silica AO collision. Considerable experimental efforts have been undertaken to minimize such AO-based degradations. As our simulations demonstrate, ReaxFF can provide a cost-effective screening tool for future material optimization.

Molecular Dynamics Simulation of Cracking Process of Bisphenol F Epoxy Resin under High-Energy Particle Impact

A Reactive Molecular Dynamics Study on Crosslinked Epoxy Resin Decomposition under High Electric Field and Thermal Aging Conditions

Space charge performance of epoxy composites with improved thermal property at high temperature under high electric field

Influence of DBD Treated Nano‐al2o3 on Thermal and Electrical Insulation Properties of Epoxy Nanocomposites at High Temperatures

Investigation of Electrical and Thermal Behavior of Modified Epoxy Structures for DC and High Frequency Applications

Synergistic Effects of Micro-hBN and Core-Shell Nano-TiO2@SiO2 on Thermal and Electrical Properties of Epoxy at High Frequencies and Temperatures

Study on the cracking process of epoxy resin under oxygen and water atmosphere based on ReaxFF force field

Effect of temperature and water penetration on the interfacial bond between epoxy resin and glass fiber: A molecular dynamics study

The Jumping Dielectric Breakdown Behavior Induced by Crack Propagation in Ferroelectric Materials: A Phase Field Study

Temperature effects on the sheath-core bar interface of compositeinsulators: a molecular dynamics and DFT study

Reactive molecular dynamics simulation on the disintegration of Kapton, POSS polyimide, amorphous silica, and teflon during atomic oxygen impact using the ReaxFF reactive force-field method

Influence of dielectric barrier effect and thermally‐conductive network on thermal and electrical properties of epoxy under different frequencies and temperatures

A Method for Simulating Abnormal Heating Internal Interface of Composite Insulator Based on Electromagnetic Heating

Insights into the pyrolysis mechanisms of epoxy resin polymers based on the combination of experiments and ReaxFF-MD simulation

Clarifying the chemical reactions of the weakening of adhesion between epoxy resin and aluminum by molecular dynamic simulation and experiment

Study on the Morphology Characteristics of Epoxy Resin of Composite Insulator under Acid-heat Condition

Molecular dynamics study on the influence of thermal aging on the mechanical properties of epoxy resins for high voltage bushing

Temperature- and thickness-dependent electrical breakdown modulated by a coupling model of charge transport and molecular chain dynamics

A reactive molecular dynamics simulation of the atomic oxygen impact on poly(p-phenylene-terephthalamide)

Theoretical Study on Decomposition Mechanism of Insulating Epoxy Resin Cured by Anhydride

Influence of water penetration on glass fiber-epoxy resin interface under electric field: A DFT and molecular dynamics study