Shape memory interpenetrating network hybrids of epoxy/poly(urea-amide) and organic nanoparticle

Ayesha Kausar
DOI: https://doi.org/10.1080/22243682.2017.1329028
2017-05-18
Journal of the Chinese Advanced Materials Society
Abstract:In this study, a novel poly(urea-amide) (PUA) was designed and blended with N,N-diglycidyl-4-glycidyloxyaniline (DGOA) epoxy. Moreover, an original approach was adopted for the formation of organic nanoparticle (NP) using resorcinol and cetyltrimethylammonium bromide. Functional nanoparticle (1–10 wt.%) was reinforced in PUA and DGOA/PUA blend and structure, morphology, and mechanical properties of neat PUA, blend and hybrids were reported. According to gel permeation chromatography analysis, molecular weight of PUA was found to decrease with nanoparticle addition. Field emission scanning electron microscopy micrographs of DGOA/PUA/NP hybrids revealed self-assembled interpenetrating network (IPN) morphology due to fine compatibility between the blend components and functional nanoparticle. The self-assembled IPNs were in turn responsible for higher mechanical properties of DGOA/PUA blend and hybrids. There was 75% rise in tensile strength and 76% increase in Young's modulus of 10 wt.% loaded DGOA/PUA hybrid than neat PUA. DGOA/PUA with higher nanofiller loading depicted 95% shape recovery with thermal heating up to 40 °C.
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