Design and Performance of a 1 ms High-Speed Vision Chip with 3D-Stacked 140 GOPS Column-Parallel PEs †

Atsushi Nose,Tomohiro Yamazaki,Hironobu Katayama,Shuji Uehara,Masatsugu Kobayashi,Sayaka Shida,Masaki Odahara,Kenichi Takamiya,Shizunori Matsumoto,Leo Miyashita,Yoshihiro Watanabe,Takashi Izawa,Yoshinori Muramatsu,Yoshikazu Nitta,Masatoshi Ishikawa
DOI: https://doi.org/10.3390/s18051313
IF: 3.9
2018-04-24
Sensors
Abstract:We have developed a high-speed vision chip using 3D stacking technology to address the increasing demand for high-speed vision chips in diverse applications. The chip comprises a 1/3.2-inch, 1.27 Mpixel, 500 fps (0.31 Mpixel, 1000 fps, 2 × 2 binning) vision chip with 3D-stacked column-parallel Analog-to-Digital Converters (ADCs) and 140 Giga Operation per Second (GOPS) programmable Single Instruction Multiple Data (SIMD) column-parallel PEs for new sensing applications. The 3D-stacked structure and column parallel processing architecture achieve high sensitivity, high resolution, and high-accuracy object positioning.
engineering, electrical & electronic,chemistry, analytical,instruments & instrumentation
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