Thin, Porous, and Conductive Networks of Metal Nanoparticles through Electrochemical Welding on a Liquid Metal Template

Jianbo Tang,Xi Zhao,Jing Li,Jing Liu
DOI: https://doi.org/10.1002/admi.201800406
IF: 5.4
2018-05-21
Advanced Materials Interfaces
Abstract:Manipulating particles using a fluid interface has both fundamental implications and technological promises. However, the stabilization of interfacial particle structures remains challenging. This study proposes a room‐temperature particle cross‐linking strategy achieved by introducing a surface transition process to metal particles confined at a liquid metal–electrolyte template, which is electrochemically reducing. The method enables cross‐linking Cu nanoparticles into nanoporous networks of micrometric thickness. It is shown that the particle networks possess remarkable mechanical strength and can be readily isolated and then be transferred onto desired substrates. The electrical properties of the material due to network formation are further highlighted, with a focus on an anomalous electric‐field‐induced resistance reduction effect. Such favorable mechanical property and intriguing conducting behavior forecast promising perspectives of the material for smart sensor applications or novel electronic devices. Meanwhile, the proposed particle cross‐linking method can provide general implications for particle‐based, interface‐assisted fabrication. A liquid‐metal‐enabled electrochemical welding phenomenon is discovered for room‐temperature, in‐solution cross‐linking of metal particles. Cu nanoparticles are “welded” together to form continuous, thin, porous, and conductive networks through interfacial electrochemical processes. The obtained materials reveal strong mechanical strength and anomalous electric‐field‐induced resistance drop as a result of network formation.
materials science, multidisciplinary,chemistry
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