Few-shot unseen defect segmentation for polycrystalline silicon panels with an interpretable dual subspace attention variational learning framework
Haiming Yao,Wei Luo,Wenyong Yu,Xiaotian Zhang,Zhenfeng Qiang,Donghao Luo,Hui Shi
DOI: https://doi.org/10.1016/j.aei.2024.102613
IF: 8.8
2024-05-30
Advanced Engineering Informatics
Abstract:Polycrystalline silicon panels (PSPs) hold immense significance in the photovoltaic industry, with their surface quality profoundly impacting optical performance. Hence, online visual surface defect detection for these panels carries significant implications for the manufacturing process. However, current inspection methods, particularly manual ones, are inefficient. Furthermore, most current automated optical inspection methods heavily rely on large-scale datasets and are insufficient in addressing unseen defect types. To address these challenges, this paper introduces a smart PSP quality inspection system, leveraging cloud–edge computing collaboration. Additionally, we propose a novel Dual Subspace Attention Variational Learning (DS-AVL) approach for few-shot unseen defect segmentation in PSPs. Within the framework of this intelligent inspection system, DS-AVL first extracts foreground and background prototypes and obtains corresponding attention maps using the proposed non-parametric Fore/Background Semantic Separation (FB-SS) module. Then, it performs probabilistic variational inference for the fore/background dual subspace distributions to address the complex texture of PSPs and the inherent uncertainties due to limited samples. Finally, the defective foreground and normal background can be segmented using non-classifier predictions based on statistical properties. The proposed DS-AVL model uniquely integrates attributes from both deep learning and statistical learning, establishing a lightweight yet robust framework that demonstrates substantial interpretability. Furthermore, we have established a publicly available benchmark for the PSP industry, on which we conducted extensive experimentation to demonstrate that our approach not only yields optimal results but also boasts efficient inference performance. More importantly, we found that DS-AVL can be directly adapted to few-shot segmentation tasks of other materials without any fine-tuning.
engineering, multidisciplinary,computer science, artificial intelligence