Processing Halide Perovskite Materials with Semiconductor Technology

Chuantong Cheng,Cheng Zhu,Beiju Huang,Huan Zhang,Hengjie Zhang,Run Chen,Weihua Pei,Qi Chen,Hongda Chen
DOI: https://doi.org/10.1002/admt.201800729
IF: 6.8
2019-04-01
Advanced Materials Technologies
Abstract:Semiconductor technologies make major contributions to scientific and technological improvements, enabling high‐performance and low‐cost devices, chips, and systems. Photolithography technologies are at the heart of semiconductor technologies and are indispensable in fabricating microstructures and nanostructures. It is obvious that a new emerging material can play a greater role in economic development if it can be processed with photolithography technologies. Halide perovskites have received an enormous amount of attention, as they are useful in photonic and optoelectronic applications due to their strong optical absorption, tunable direct bandgap, and long electron–hole diffusion length. However, photolithography technologies cannot be utilized to fabricate semiconductor devices based on halide perovskite materials because water, a solvent for all halide perovskite materials, is used in the fabrication process. Here, the process compatibility between halide perovskite materials and semiconductor technology is realized with the help of parylene, a kind of polymer. A photodetector based on MAPbI3 and a memristor based on CsPbBr3 fabricated with photolithography technologies are both demonstrated successfully for the first time. This study not only paves the way toward the fabrication of halide perovskite devices with semiconductor technologies but also provides a powerful tool for the in‐depth study of halide perovskite materials. Microscale metal structures are fabricated on the surface of metal halide perovskites with photolithography technology with the assistance of a parylene sacrificial layer. This novel fabrication method provides the ability to handle perovskites with semiconductor technologies.
materials science, multidisciplinary
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