Abstract:With the improvement of chip performance, the requirements for cleaning the surface of silicon wafers are becoming higher. However, due to equipment and technology, it is difficult to observe the complex motion processes of particles at the microscopic scale. In this paper, an in situ dynamic visualization experiment on the cleaning of Polystyrene Latex (PSL) on the surface of silicon wafers is carried out by using a high-speed camera and image processing software. The mechanical behavior of PSL particles in fluid was investigated on a microscopic scale, and the trajectory and force of the polystyrene particles on the surface of the wafers were visualized, which provided a new perspective for understanding the complex cleaning process. Theoretical models were developed to explain the motion characteristics of the particles by calculating parameters such as van der Waals force, surface tension, and trailing force, and these models provide a theoretical basis for optimizing the cleaning process. There are four particle motion modes in the fluid: (1) interface capture, where the particles on the surface of silicon wafer are trapped by gas–liquid interface under surface tension; (2) particle collision, where the particles captured by the water film collide with the particles on the wafer surface to make the latter leave the silicon wafer; (3) jump attachment, where the particles jump and attach to the surface of the particle group under the action of lift; and (4) wall surface movement, where the particles start up under the action of water flow and then leave the silicon wafer quickly.

Real Time Nanoscale Cleaning Phenomenon Observation during PVA Brush Scrubbing by Evanescent Field

Probing particle removal in brush scrubber cleaning with fluorescence technique

Dynamic Visualization Study of in Situ Cleaning of Polystyrene Microparticles off Silicon Wafer Surface

Mechanisms for nano particle removal in brush scrubber cleaning

Effect of Various Cleaning Solutions and Brush Scrubber Kinematics on the Frictional Attributes of Post Copper Cmp Cleaning Process

Atomic Force Microscope Tip Cleaning by Using Gratings As Micro‐washboards

Effect of Process Parameter on Particle Removal Efficiency in Brush Scrubber Cleaning

A Contactless Methodology of Picking Up Micro-Particles from Rigid Surfaces by Acoustic Radiation Force

PVA Brush Technology for Next Generation Post-CMP Cleaning Applications

Particles Detection and Analysis of Hard Disk Substrate after Cleaning of Post Chemical Mechanical Polishing

Use of plasma process diagnostic sensors for the monitoring of in situ dry cleaning of plasma enhanced chemical vapor deposition chamber

Mechanism Analysis of Nanoparticle Removal Induced by the Marangoni-driven Flow in Post-CMP Cleaning

Observing Wetting Behaviors of UV-curable Liquid on Nanostructured Surfaces with Sub-20 Nm Resolution

Mechanism Analysis of Megasonic and Brush Cleaning Processes for Silicon Substrate after Chemical Mechanical Polishing

Non-contact removal of 60-nm latex particles from silicon wafers with laser-induced plasma

Application of Ultraviolet Fluorescence in Wafer Surface Cleaning Analysis

Nanoscale Adsorption, Assembly, and Deionization Dynamics Recorded by Optical Fiber Sensors

Atomic-scale Study on Particle Movement Mechanism During Silicon Substrate Cleaning Using ReaxFF MD

Gaas Surface Wet Cleaning by A Novel Treatment in Revolving Ultrasonic Atomization Solution

Time-resolved imaging for investigating laser-material interactions during laser irradiation cleaning on murals

Surface Reconstruction on Electro-Spun PVA/PVP Nanofibers by Water Evaporation