Nano-silica reinforced epoxy resin/nano-rubber composite material with a balance of stiffness and toughness

Shuo Wang,Meng Cao,Hongqian Xue,Fanglin Cong,Xiaodong Li,Changbao Zhao,Weiguo Su
DOI: https://doi.org/10.1177/0954008320988752
IF: 1.73
2021-01-20
High Performance Polymers
Abstract:In the electronics and aerospace industries, epoxy resins are generally regarded as economical and efficient adhesives and have a high status. However, epoxy resins are highly crosslinked polymers and are very brittle adhesives where they are prone to fast crack propagation under dynamic loads. Therefore, it is very necessary to enhance the toughness of epoxy resin adhesives. Nano-rubber has been proved to be an important toughening agent for epoxy resin, which can significantly improve the fracture toughness of epoxy resin. However, increasing the toughness of epoxy resin by adding nanomaterials is often accompanied by decreasing the strength and stiffness of resin. Therefore, in this work, rigid nano-silica particles were added to improve the rigidity and tensile strength reduction caused by the addition of rubber particles. And further increase the toughness of the epoxy resin to obtain an epoxy adhesive with balanced stiffness-toughness. As a result, it can be found that the addition of silica particles can significantly improve the decrease in stiffness caused by the addition of rubber particles. For example, Young’s modulus and tensile strength are increased by 28%, and 23%, respectively, with 4% silica is added based on rubber particles. Through the single lap shear experiment, it is found that the shear strength of the epoxy/RnP/silica composite adhesive has increased, which further proves that the addition of nano-silica particles can increase the stiffness of the epoxy composite. The dynamic mechanical analysis experiment found that after adding nano-silica particles, the storage modulus of epoxy composites increased, which also shows that adding nano-silica particles can improve the stiffness of epoxy composites. Scanning electron microscopy analysis was performed to study the reinforcement mechanism of epoxy/RnP/silica composite materials. The thermal stability of epoxy composites was characterized by Dynamic mechanical analysis and thermogravimetric analysis.
polymer science
What problem does this paper attempt to address?
This paper attempts to solve some key problems in the application of epoxy resin as an adhesive in the electronics and aerospace industries. Specifically, although epoxy resin is cost - effective, it is relatively brittle and prone to rapid crack propagation under dynamic loads, which limits its use in applications requiring high toughness. Therefore, the main objective of the paper is to enhance the toughness of epoxy resin by adding nanomaterials while maintaining or increasing its stiffness and strength, in order to obtain an epoxy resin adhesive with a good balance between stiffness and toughness. To achieve this goal, the author adopts two main strategies: 1. **Adding nano - rubber**: Nano - rubber has been proven to be an effective toughening agent for epoxy resin and can significantly improve the fracture toughness of epoxy resin. 2. **Adding nano - silica**: Since the addition of nano - rubber will reduce the stiffness and tensile strength of epoxy resin, rigid nano - silica particles are further added to compensate for the decline in these properties and further improve the toughness of epoxy resin. Through these methods, the author hopes to develop an epoxy resin composite with a good balance between stiffness and toughness, thus showing more excellent mechanical properties in practical applications.